Cure kinetics of an epoxy-anhydride-imidazole resin system by isothermal DSC

被引:11
|
作者
Wang, C. S.
Kwag, Choongyong
机构
[1] GM Corp, Ctr Res & Dev, Mat & Proc Lab, Warren, MI 48090 USA
[2] Rocardo Meda Tech Serv LLC, Southfield, MI USA
来源
POLYMERS & POLYMER COMPOSITES | 2006年 / 14卷 / 05期
关键词
D O I
10.1177/096739110601400501
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The cure kinetics of a dimethyl imidazole catalyzed diglycidyl ether of bisphenol A methyltetrahydrophthalic anhydride resin system was examined. Degree of conversion versus cure time was obtained using isothermal DSC over the temperature range from 80 degrees C to 140 degrees C. The kinetic data were analysed using both nth order and autocatalytic kinetic models. The results indicated that the epoxy curing process could be described satisfactorily by Kamal's four-parameter generalised autocatalytic model modified with an exponential function of conversion defined as the diffusion factor. The curing process was predominantly autocatalytic in nature. The autocatalytic rate constant of the resin system was 10 to 60 times larger than the nth order rate constant. The corresponding activation energies obtained from Arrhenius equation were 78.1 kJ/mol and 67.6 kJ/mol, respectively. The approximate order of reaction was 0.39 for the autocatalytic reactions and 1.0 for the nth order reactions.
引用
收藏
页码:445 / 454
页数:10
相关论文
共 50 条
  • [31] DSC study of cure kinetics of DGEBA-based epoxy resin with poly(oxypropylene) diamine
    J. Macan
    I. Brnardić
    M. Ivanković
    H. J. Mencer
    [J]. Journal of Thermal Analysis and Calorimetry, 2005, 81 : 369 - 373
  • [32] Curing kinetics study of epoxy resin/flexible amine toughness systems by dynamic and isothermal DSC
    Cai, Hongyang
    Li, Peng
    Sui, Gang
    Yu, Yunhua
    Li, Gang
    Yang, Xiaoping
    Ryu, Seungkon
    [J]. THERMOCHIMICA ACTA, 2008, 473 (1-2) : 101 - 105
  • [33] Isothermal curing kinetics of a flame retardant epoxy resin containing DOPO investigated by DSC and rheology
    Hu, Jianhua
    Shan, Jiye
    Zhao, Jianqing
    Tong, Zhen
    [J]. THERMOCHIMICA ACTA, 2016, 632 : 56 - 63
  • [34] The study on Curing kinetics of lignin-based epoxy resin system using non-isothermal DSC Method
    Chen, Mingqiang
    Liu, Shaomin
    Li, Feng
    Yang, Zhonglian
    Zhang, Ye
    [J]. ADVANCED RESEARCH ON MATERIAL ENGINEERING, CHEMISTRY AND ENVIRONMENT, 2013, 788 : 223 - +
  • [35] Isothermal cure kinetics and thermodynamics of an epoxy-nickel-diamine system
    Ghaemy, M
    Rostami, AA
    Omrani, A
    [J]. POLYMER INTERNATIONAL, 2006, 55 (03) : 279 - 284
  • [36] DIFFERENTIAL SCANNING CALORIMETRY OF EPOXY CURE - ISOTHERMAL CURE KINETICS
    SOUROUR, S
    KAMAL, MR
    [J]. THERMOCHIMICA ACTA, 1976, 14 (1-2) : 41 - 59
  • [37] Cure kinetics of epoxy resin with styrene maleic anhydride copolymer by differential scanning calorimetry technique
    Vora, RA
    Trivedi, HC
    Patel, CP
    Kazlauciunas, A
    Guthrie, JT
    Trivedi, MC
    [J]. POLYMERS & POLYMER COMPOSITES, 1996, 4 (01): : 61 - 67
  • [38] Cure kinetics of epoxy resin with styrene maleic anhydride copolymer by differential scanning calorimetry technique
    M.S. Univ, Baroda, India
    [J]. Polym Polym Compos, 1 (61-67):
  • [39] Cure kinetics of biphenyl epoxy resin system using latent catalysts
    Kim, WG
    Yoon, HG
    Lee, JY
    [J]. JOURNAL OF APPLIED POLYMER SCIENCE, 2001, 81 (11) : 2711 - 2720
  • [40] Cure Kinetics of Epoxy Resin System Toughened by Polyhexamethylene Carbonate Diol
    Chen Tonghui
    Bai Yaowen
    Sun Renhui
    [J]. ACTA PHYSICO-CHIMICA SINICA, 1997, 13 (09) : 848 - 852