Cure kinetics of biphenyl epoxy resin system using latent catalysts

被引:35
|
作者
Kim, WG
Yoon, HG
Lee, JY
机构
[1] Seokyeong Univ, Dept Chem, Seongbuk Ku, Seoul 136704, South Korea
[2] Korea Univ, Dept Mat Sci, Seongbuk Ku, Seoul 136701, South Korea
[3] Sungkyunkwan Univ, Dept Text Engn, Jangan Gu, Suwon 440746, Kyunggi Do, South Korea
关键词
biphenyl epoxy resin; phenol resin; latent catalyst; shelf life; cure kinetics;
D O I
10.1002/app.1717
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
The investigation of the cure kinetics of a biphenyl epoxy-phenol resin system with different kinds of latent catalysts was performed by differential scanning calorimetry using an isothermal approach. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicated that the curing reaction of the biphenyl epoxy resin system in this experiment proceeded through an autocatalytic kinetic mechanism, irrespective of the kind of catalyst. The epoxy resin system with acid/diazabicycloundecene (DBU) salt as the latent catalyst showed a second overall reaction order; however, a third reaction order was represented for microencapsulated triphenylphosphine (TPP). The storage stability tests for these systems were performed, and a good shelf life was observed in the epoxy resin system with pyromellitic acid/DBU salt, trimellitic acid/DBU salt, and microencapsulated TPP as the latent catalyst. (C) 2001 John Wiley & Sons, Inc.
引用
收藏
页码:2711 / 2720
页数:10
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