Electrodeposition of FeCoNiCu/Cu compositionally modulated multilayers

被引:28
|
作者
Huang, Q [1 ]
Young, DP
Chan, JY
Jiang, J
Podlaha, EJ
机构
[1] Louisiana State Univ, Gordon A & Mary Cain Dept Chem Engn, Baton Rouge, LA 70803 USA
[2] Louisiana State Univ, Dept Phys, Baton Rouge, LA 70803 USA
[3] Louisiana State Univ, Dept Chem, Baton Rouge, LA 70803 USA
[4] Louisiana State Univ, Dept Mech Engn, Baton Rouge, LA 70803 USA
关键词
D O I
10.1149/1.1474433
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
The electrodeposition of the FeCoNiCu quaternary system onto a rotating disk electrode was explored in order to prepare compositionally modulated multilayers. Multilayers having a different layer thickness were electrodeposited by a pulse current method and the structure was determined with transmission electron microscopy and X-ray diffraction. When the multilayer alloy thickness was larger than 10 nm, the deposit grain size was found to be a function of the Co-rich layer thickness. Below an alloy thickness of 10 nm, the Cu layer size was correlated with a preferred deposit orientation. Giant magnetoresistance was also observed for this electrodeposited quaternary system for the first time. (C) 2002 The Electrochemical Society.
引用
收藏
页码:C349 / C354
页数:6
相关论文
共 50 条
  • [21] GROWTH MODES AND STRUCTURE OF METALLIC COMPOSITIONALLY MODULATED MULTILAYERS
    FLEVARIS, NK
    JOURNAL DE MICROSCOPIE ET DE SPECTROSCOPIE ELECTRONIQUES, 1989, 14 (06): : 397 - &
  • [22] STRUCTURAL, OPTICAL AND MAGNETIC ANISOTROPIES IN COMPOSITIONALLY MODULATED MULTILAYERS
    FLEVARIS, NK
    JOURNAL OF METALS, 1988, 40 (07): : A84 - A84
  • [23] COHERENCY STRAINS AND GROWTH HABITS IN COMPOSITIONALLY MODULATED MULTILAYERS
    FLEVARIS, NK
    KARAKOSTAS, T
    MATERIALS LETTERS, 1991, 12 (1-2) : 7 - 11
  • [24] MAGNETIZATION REVERSAL IN COMPOSITIONALLY MODULATED TB/FE MULTILAYERS
    KIRBY, RD
    SHEN, JX
    SELLMYER, DJ
    JOURNAL OF APPLIED PHYSICS, 1994, 75 (10) : 6507 - 6507
  • [25] Interdiffusion in compositionally modulated amorphous Nb/Si multilayers
    Zhang, M
    Yu, W
    Wang, WH
    Wang, WK
    THIN SOLID FILMS, 1996, 287 (1-2) : 293 - 296
  • [26] Electrodeposition of Ni/Cu multilayers
    Myung, NV
    Nobe, K
    PLATING AND SURFACE FINISHING, 2000, 87 (06): : 125 - 134
  • [27] Electrodeposition of compositionally modulated Au/Co alloy layers
    Valizadeh, S
    Svedberg, EB
    Leisner, P
    JOURNAL OF APPLIED ELECTROCHEMISTRY, 2002, 32 (01) : 97 - 104
  • [28] Electrodeposition of compositionally modulated Au/Co alloy layers
    S. Valizadeh
    E.B. Svedberg
    P. Leisner
    Journal of Applied Electrochemistry, 2002, 32 : 97 - 104
  • [29] Single-bath electrodeposition of chromium-nickel compositionally modulated multilayers (CMM) from a trivalent chromium bath
    Rousseau, A
    Benaben, P
    PLATING AND SURFACE FINISHING, 1999, 86 (09): : 106 - 110
  • [30] Electrodeposition of Ni/Cu and Co/Cu multilayers
    Myung, N
    Ryu, KH
    Sumodjo, PTA
    Nobe, K
    PROCEEDINGS OF THE SYMPOSIUM ON FUNDAMENTAL ASPECTS OF ELECTROCHEMICAL DEPOSITION AND DISSOLUTION INCLUDING MODELING, 1998, 97 (27): : 270 - 281