Front Side Protection Layer for Improved Reliability of Wafer-Level Packages

被引：1
|
作者：
Peddi, R. [1 ]
Dutt, G. [1 ]
Wyatt, D. [1 ]
Tang, Hao [1 ]
Perez, A. [1 ]
Frye, D. [1 ]
机构：
[1] Henkel Corp, Rancho Dominguez, CA 90221 USA
来源：
2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4 | 2009年
关键词：
D O I：
10.1109/ECTC.2009.5074180
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
This paper will describe a new technique to increase the reliability of wafer-level packages (WLPs). The technique enables the placement of a protective coating around the solder balls using a maskless process and provides improved reliability performance as compared to unprotected devices. In addition, the unbonded devices allow for easier handling. This approach also minimizes form factor requirements associated with the use of traditional capillary underfills. Feasibility studies and preliminary performance results are presented in this paper.
引用
收藏
页码：1307 / 1310
页数：4
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