Spectral Characterization of Hierarchical Modularity in Product Architectures

被引:35
|
作者
Sarkar, Somwrita [1 ]
Dong, Andy [2 ]
Henderson, James A. [3 ]
Robinson, P. A. [3 ,4 ]
机构
[1] Univ Sydney, Design Lab, Fac Architecture Design & Planning, Sydney, NSW 2006, Australia
[2] Univ Sydney, Fac Engn & Informat Technol, Sydney, NSW 2006, Australia
[3] Univ Sydney, Sch Phys, Complex Syst Grp, Sydney, NSW 2006, Australia
[4] Univ Sydney, Sydney Med Sch, Brain Dynam Ctr, Westmead, NSW 2145, Australia
基金
澳大利亚研究理事会; 美国国家科学基金会;
关键词
DESIGN; COMPONENTS; PLATFORM; SYSTEMS;
D O I
10.1115/1.4025490
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
Despite the importance of the architectural modularity of products and systems, existing modularity metrics or algorithms do not account for overlapping and hierarchically embedded modules. This paper presents a graph theoretic spectral approach to characterize the degree of modular hierarchical-overlapping organization in the architecture of products and complex engineered systems. It is shown that the eigenvalues of the adjacency matrix of a product architecture graph can reveal layers of hidden modular or hierarchical modular organization that are not immediately visible in the predefined architectural description. We use the approach to analyze and discuss several design, management, and system resilience implications for complex engineered systems.
引用
收藏
页数:12
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