Low melting point alloy hermetic seal

被引：0
|
作者：
不详
机构：
来源：
BRITISH CORROSION JOURNAL | 1996年 / 31卷 / 04期
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：258 / 258
页数：1
相关论文
共 50 条
  • [31] An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler
    Yim, Byung-Seung
    Lee, Jeong Il
    Lee, Byung Hun
    Shin, Young-Eui
    Kim, Jong-Min
    MICROELECTRONICS RELIABILITY, 2014, 54 (12) : 2944 - 2950
  • [32] Printing of Low-Melting-Point Alloy as Top Electrode for Organic Solar Cells
    Yu, Boyang
    Liu, Linna
    Liu, Bingyang
    Zhao, Xinyan
    Deng, Weiwei
    ADVANCED OPTICAL MATERIALS, 2023, 11 (02)
  • [33] Characteristics of a MHD power generator using a low-melting-point Gallium alloy
    Niu, Xiao-Dong
    Yamaguchi, Hiroshi
    Ye, Xiao-Jiang
    Iwamoto, Yuhiro
    ELECTRICAL ENGINEERING, 2014, 96 (01) : 37 - 43
  • [34] Operation time control of a high density packaging using a low melting point alloy
    Ishizuka, M
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2004, 27 (02): : 239 - 243
  • [35] Characteristics of a MHD power generator using a low-melting-point Gallium alloy
    Xiao-Dong Niu
    Hiroshi Yamaguchi
    Xiao-Jiang Ye
    Yuhiro Iwamoto
    Electrical Engineering, 2014, 96 : 37 - 43
  • [36] Analysis of copper foam/low melting point alloy composite phase change material
    Hou Tianrui
    Xing Yuming
    Zheng Wenyuan
    Hao Zhaolong
    APPLIED THERMAL ENGINEERING, 2022, 204
  • [37] Flexible Mechanical Joint as Human Exoskeleton Using Low-Melting-Point Alloy
    Deng, Yueguang
    Liu, Jing
    JOURNAL OF MEDICAL DEVICES-TRANSACTIONS OF THE ASME, 2014, 8 (04):
  • [38] TECHNIQUE FOR USING LOW MELTING-POINT ALLOY FOR INDIVIDUAL PATIENT SHIELDING IN RADIOTHERAPY
    MARSHALL, TJ
    MOTT, GT
    GRIEVESON, MH
    BRITISH JOURNAL OF RADIOLOGY, 1975, 48 (575): : 924 - 926
  • [39] NON-SELECTIVE CORROSION OF ALLOY STEELS IN LIQUID LOW MELTING POINT METALS
    NIKITIN, VI
    RUSSIAN METALLURGY, 1965, (06): : 110 - &
  • [40] Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers
    Yim, Byung-Seung
    Lee, Jeong Il
    Heo, Yuseon
    Kim, Jooheon
    Lee, Seong Hyuk
    Shin, Young-Eui
    Kim, Jong-Min
    MATERIALS TRANSACTIONS, 2012, 53 (12) : 2104 - 2110
12345