Effects of copper on the electrodeposition of nickel

被引:0
|
作者
Yu, JX [1 ]
Chen, YY [1 ]
Yang, HX [1 ]
机构
[1] Wuhan Univ, Dept Chem, Wuhan 430072, Peoples R China
关键词
D O I
暂无
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
The effects of the Cu2+ concentration on the electrodeposition of nickel onto the glassy carbon electrode is studied by cyclic voltammetry and the step potential method in a sulphate solution. It is found that when increasing the Cu2+ concentration, the reduction potential of nickel shifts to the positive direction, the current loops of nickel electrocrystallization narrow and the nucleation activation energy Delta G of nickel decreases.
引用
收藏
页码:1173 / 1176
页数:4
相关论文
共 50 条
  • [41] Leveling and microstructural effects of additives for copper electrodeposition
    Kelly, JJ
    Tian, CY
    West, AC
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1999, 146 (07) : 2540 - 2545
  • [42] Effects of Additives on Electrodeposition for Smooth Copper Foils
    Takeda, Erika
    Okamoto, Naoki
    Saito, Takeyasu
    Kondo, Kazuo
    KAGAKU KOGAKU RONBUNSHU, 2011, 37 (06) : 551 - 555
  • [43] Hierarchical structured nickel-copper hybrids via simple electrodeposition
    Yue, Yuan
    Coburn, Keeley
    Reed, Brady
    Liang, Hong
    JOURNAL OF APPLIED ELECTROCHEMISTRY, 2018, 48 (03) : 275 - 286
  • [44] The development of a stable citrate electrolyte for the electrodeposition of copper-nickel alloys
    Green, TA
    Russell, AE
    Roy, S
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1998, 145 (03) : 875 - 881
  • [45] Voltammetric and amperometric analyses of electrochemical nucleation: electrodeposition of copper on nickel and tantalum
    Emery, SB
    Hubbley, JL
    Roy, D
    JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 2004, 568 (1-2) : 121 - 133
  • [46] Electrodeposition and characterization of nickel–copper metallic foams for application as electrodes for supercapacitors
    S. Eugénio
    T. M. Silva
    M. J. Carmezim
    R. G. Duarte
    M. F. Montemor
    Journal of Applied Electrochemistry, 2014, 44 : 455 - 465
  • [47] ROLE OF PROTONATION OF COMPLEXES DURING THE ELECTRODEPOSITION OF A COPPER NICKEL-ALLOY
    BEREZINA, SI
    DOBRENKOV, NG
    KESHNER, TD
    JOURNAL OF APPLIED CHEMISTRY OF THE USSR, 1988, 61 (06): : 1278 - 1280
  • [48] LASER-STIMULATED ELECTRODEPOSITION OF NICKEL ON COPPER FROM SULFATE ELECTROLYTE
    SERYANOV, YV
    NESTERENKO, MV
    PROTECTION OF METALS, 1991, 27 (05): : 661 - 663
  • [49] Investigation of a copper–nickel alloy resistor using co-electrodeposition
    Wen-His Lee
    K. C. Chung
    Journal of Applied Electrochemistry, 2020, 50 : 535 - 547
  • [50] Electrodeposition of nickel
    Bennett, CW
    Kenny, HC
    Dugliss, RP
    JOURNAL OF PHYSICAL CHEMISTRY, 1914, 18 (05): : 373 - 384