Effects of copper on the electrodeposition of nickel

被引：0
|
作者：
Yu, JX [1 ]
Chen, YY [1 ]
Yang, HX [1 ]
机构：
[1] Wuhan Univ, Dept Chem, Wuhan 430072, Peoples R China
来源：
RUSSIAN JOURNAL OF ELECTROCHEMISTRY | 1999年 / 35卷 / 11期
关键词：
D O I：
暂无
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
The effects of the Cu2+ concentration on the electrodeposition of nickel onto the glassy carbon electrode is studied by cyclic voltammetry and the step potential method in a sulphate solution. It is found that when increasing the Cu2+ concentration, the reduction potential of nickel shifts to the positive direction, the current loops of nickel electrocrystallization narrow and the nucleation activation energy Delta G of nickel decreases.
引用
收藏
页码：1173 / 1176
页数：4
相关论文
共 50 条
  • [21] Electrodeposition of nickel-copper on titanium nitride for methanol electrooxidation
    Mao, Ying-Hsiao
    Chen, Chia-Yu
    Fu, Ji-Xuan
    Lai, Ting-Yu
    Lu, Fu-Hsing
    Tsai, Yu-Chen
    SURFACE & COATINGS TECHNOLOGY, 2018, 350 : 949 - 953
  • [22] The electrodeposition of a copper/nickel multilayer alloy on beryllium bronze substrate
    Xue, QJ
    Zhang, W
    JOURNAL OF PHYSICS D-APPLIED PHYSICS, 1997, 30 (24) : 3301 - 3306
  • [23] IMPEDENCE STUDIES AT COPPER AND NICKEL ELECTRODES - ELECTRODEPOSITION OF CU AND NI
    PEARSON, IM
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1965, 112 (08) : C180 - &
  • [24] Hierarchical structured nickel–copper hybrids via simple electrodeposition
    Liang, Hong (hliang@tamu.edu), 1600, Springer Science and Business Media B.V. (48):
  • [25] ELECTRODEPOSITION OF COPPER AND NICKEL COATINGS ON ANODICALLY OXIDIZED STEEL.
    Sverdlov, A.I.
    Bogoyavlenskii, A.F.
    Kasimov, I.K.
    Protection of Metals (English translation of Zaschita Metallov), 1983, 19 (03): : 397 - 399
  • [26] Hierarchical structured nickel–copper hybrids via simple electrodeposition
    Yuan Yue
    Keeley Coburn
    Brady Reed
    Hong Liang
    Journal of Applied Electrochemistry, 2018, 48 : 275 - 286
  • [27] Effect of water on the electrodeposition of copper on nickel in deep eutectic solvents
    Al-Murshedi, A. Y. M.
    Hartley, J. M.
    Abbott, A. P.
    Ryder, K. S.
    TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 2019, 97 (06): : 321 - 329
  • [28] Exploratory study of copper particles electrodeposition on nickel by induction heating
    Devillers, Sebastien
    Lemineur, Quentin
    Delhalle, Joseph
    Mekhalif, Zineb
    ELECTROCHIMICA ACTA, 2011, 56 (14) : 4953 - 4959
  • [29] COPPER AND NICKEL ELECTRODEPOSITION KINETICS AT THE GROWTH FRONT OF NONEQUIPOTENTIAL ELECTRODES
    RUDOI, VM
    PETROVA, NA
    ZINIGRAD, EA
    SOVIET ELECTROCHEMISTRY, 1984, 20 (12): : 1516 - 1521
  • [30] Via filling by electrodeposition - Superconformal silver and copper and conformal nickel
    Josell, D
    Baker, B
    Witt, C
    Wheeler, D
    Moffat, TP
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2002, 149 (12) : C637 - C641
12345