Special Issue Metamaterials, Metadevices and Applications

被引：0
|
作者：
Cui, Tie Jun [1 ]
Alu, Andrea [2 ]
Pendry, John [3 ]
机构：
[1] Southeast Univ, Nanjing, Peoples R China
[2] CUNY, Adv Sci Res Ctr, New York, NY 10021 USA
[3] Imperial Coll London, London, England
来源：
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2022年 / 70卷 / 12期
关键词：
Compilation and indexing terms; Copyright 2024 Elsevier Inc;
D O I：
10.1109/TMTT.2022.3226651
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：5454 / 5455
页数：2
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