A failure criterion for debonding between encapsulants and leadframes in plastic IC packages

被引：16

作者：

Yi, S ^{[1
]}

Shen, LX ^{[1
]}

Kim, JK ^{[1
]}

Yue, CY ^{[1
]}

机构：

[1] Nanyang Technol Univ, Sch Mech & Prod Engn, Singapore 639798, Singapore

来源：

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY | 2000年 / 14卷 / 01期

关键词：

failure criterion; bond strengths; interface stresses;

D O I：

10.1163/156856100742122

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

A failure criterion for debonding initiation between molding compounds and copper leadframes in plastic encapsulated integrated circuit (IC) packages is proposed. The leadframe pullout test is used to evaluate the bond strengths between molding compounds and leadframes in plastic encapsulated IC packages. The normal and shear stress fields along the interface are analyzed using the finite element method. An average stress approach is employed for the interface failure criterion and the tensile and shear interface bond strengths are obtained from the experimental failure loads. In a parametric study, the effects of specimen loading geometry, moisture, and surface contamination of copper leadframes on the interfacial bond strengths are specifically analyzed. The results show that the interface bond strengths determined for the two specimen geometries are consistent.

引用

页码：93 / 105

页数：13

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