Wafer-Level Packaging: Interconnects for Enhanced Reliability Foreword

被引：1
|
作者：
Nguyen, Luu T. [1 ]
机构：
[1] Natl Semicond Corp, Package Technol Grp, Santa Clara, CA 95052 USA
来源：
IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2009年 / 32卷 / 02期
关键词：
D O I：
10.1109/TADVP.2009.2022602
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：360 / 361
页数：2
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