Integrated sensor wafer-level packaging

被引：0
|
作者：
Audet, SA
Edenfeld, KM
机构：
来源：
TRANSDUCERS 97 - 1997 INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS AND ACTUATORS, DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2 | 1997年
关键词：
wafer-level packaging; frit glass;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Low cost packaging for integrated sensor devices is key to tbe ingress of silicon sensors into the consumer and industrial marketplace. Water-level. packaging for integrated sensors can be performed using several technologies. The benefits and challenges of several these technologies are described below.
引用
收藏
页码：287 / 289
页数：3
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