Wafer-level packaging and test

被引：0
|
作者：
Gilg, Larry [1 ]
机构：
[1] Die Products Consortium, 3908 Avenue G, Austin, TX 78751, United States
来源：
Advanced Packaging | 2002年 / 11卷 / 11期
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D O I：
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学科分类号：
摘要：
7
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页码：35 / 38
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