Pixel architectures in a HV-CMOS process for the ATLAS inner detector upgrade

被引：6

作者：

Degerli, Y. ^{[1
]}

Godiot, S. ^{[2
]}

Guilloux, F. ^{[1
]}

Hemperek, T. ^{[3
]}

Kruger, H. ^{[3
]}

Lachkar, M. ^{[1
]}

Liu, J. ^{[2
]}

Orsini, F. ^{[1
]}

Pangaud, P. ^{[2
]}

Rymaszewski, P. ^{[3
]}

Wang, T. ^{[3
]}

机构：

[1] CEA Saclay, IRFU, F-91191 Gif Sur Yvette, France

[2] Ctr Phys Particules, 163 Ave Luminy, Marseille, France

[3] Univ Bonn, Inst Phys, Nussallee 12, Bonn, Germany

来源：

JOURNAL OF INSTRUMENTATION | 2016年 / 11卷

关键词：

Particle tracking detectors (Solid-state detectors); Pixelated detectors and associated VLSI electronics; Front-end electronics for detector readout;

D O I：

10.1088/1748-0221/11/12/C12064

中图分类号：

TH7 [仪器、仪表];

学科分类号：

0804 ; 080401 ; 081102 ;

摘要：

dIn this paper, design details and simulation results of new pixel architectures designed in LFoundry 150 nm high voltage CMOS process in the framework of the ATLAS high luminosity inner detector upgrade are presented. These pixels can be connected to the FE- I4 readout chip via bump bonding or glue and some of them can also be tested without a readout chip. Negative high voltage is applied to the high resistivity ( > 2 k Omega.cm) substrate in order to deplete the deep n-well charge collection diode, ensuring good charge collection and radiation tolerance. In these pixels, the front- end has been implemented inside the diode using both NMOS and PMOS transistors. The pixel pitch is 50 mu m x 250 mu m for all pixels. These pixels have been implemented in a demonstrator chip called LFCPIX.

引用

页数：11

共 50 条

[31] Characterisation of novel prototypes of monolithic HV-CMOS pixel detectors for high energy physics experiments
Terzo, S.
Cavallaro, E.
Casanova, R.
Di Bello, F.
Forster, F.
Grinstein, S.
Peric, I.
Puigdengoles, C.
Ristic, B.
Barrero Pinto, M. Vicente
Vilella, E.
JOURNAL OF INSTRUMENTATION, 2017, 12
[32] System architecture of Detector Control and safety for the ATLAS Inner Detector Upgrade
Ferrere, D.
Kersten, S.
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT, 2011, 636 : S164 - S167
[33] MightyPix at the LHCb Mighty Tracker - verification of an HV-CMOS pixel chip's digital readout
Scherl, S.
Striebig, N.
Hennessy, K.
Peric, I.
Vilella, E.
JOURNAL OF INSTRUMENTATION, 2024, 19 (04)
[34] Testbeam results of irradiated ams H18 HV-CMOS pixel sensor prototypes
Benoit, M.
Braccini, S.
Casse, G.
Chen, H.
Chen, K.
Di Bello, F. A.
Ferrere, D.
Golling, T.
Gonzalez-Sevilla, S.
Iacobucci, G.
Kiehn, M.
Lanni, F.
Liu, H.
Meng, L.
Merlassino, C.
Miucci, A.
Muenstermann, D.
Nessi, M.
Okawa, H.
Peric, I.
Rimoldi, M.
Ristic, B.
Pinto, M. Vicente Barrero
Vossebeld, J.
Weber, M.
Weston, T.
Wu, W.
Xu, L.
Zaffaroni, E.
JOURNAL OF INSTRUMENTATION, 2018, 13
[35] Upgrade of Belle II vertex detector with CMOS pixel technology
Schwickardi, M.
Babeluk, M.
Barbero, M.
Baudot, J.
Bergauer, T.
Bertolone, G.
Bettarini, S.
Bosi, F.
Breugnon, P.
Buch, Y.
Casarosa, G.
Dujany, G.
Finck, C.
Forti, F.
Frey, A.
Himmi, A.
Irmler, C.
Kumar, A.
Marinas, C.
Massa, M.
Massaccesi, L.
Mazzora de Cos, J.
Minuti, M.
Mondal, S.
Pangaud, P.
Pham, H.
Ripp-Baudot, I.
Rizzo, G.
Schwenker, B.
Valin, I.
JOURNAL OF INSTRUMENTATION, 2024, 19 (01)
[36] Subpixel mapping and test beam studies with a HV2FEI4v2 CMOS-Sensor-Hybrid Module for the ATLAS inner detector upgrade
Bisanz, T.
Grosse-Knetter, J.
Quadt, A.
Rieger, J.
Weingarten, J.
JOURNAL OF INSTRUMENTATION, 2017, 12
[37] Development of a novel HV-CMOS active pixel sensor AstroPix for gamma-ray space telescopes
Sudaa, Yusuke
Caputob, Regina
Steinhebelb, Amanda L.
Striebigd, Nicolas
Jadhave, Manoj
Fukazawaa, Yasushi
Hashizumea, Masaki
Kieransb, Carolyn
Leysd, Richard
Metcalfee, Jessica
Negro, Michela
Nakanoa, Norito
Peried, Ivan
Perkinsb, Jeremy S.
Shing, Taylor
Tajimah, Hiroyasu
Violetteb, Daniel
SPACE TELESCOPES AND INSTRUMENTATION 2024: ULTRAVIOLET TO GAMMA RAY, PT 1, 2024, 13093
[38] Design and standalone characterisation of a capacitively coupled HV-CMOS sensor chip for the CLIC vertex detector
Kremastiotis, I.
Ballabriga, R.
Campbell, M.
Dannheim, D.
Fiergolski, A.
Hynds, D.
Kulis, S.
Peric, I.
JOURNAL OF INSTRUMENTATION, 2017, 12
[39] E-TCT characterization of a thinned, backside biased, irradiated HV-CMOS pixel test structure
Franks, M.
Casse, G.
Mandic, I.
Powell, S.
Vilella, E.
Vossebeld, J.
Wonsak, S.
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT, 2021, 991
[40] MuPix7-A fast monolithic HV-CMOS pixel chip for Mu3e
Augustin, H.
Berger, N.
Dittmeier, S.
Hammerich, J.
Hartenstein, U.
Huang, Q.
Huth, L.
Immig, D.
Kozlinskiy, A.
Aeschbacher, F. Meier
Peric, I.
Perrevoort, A. -K.
Schoening, A.
Shrestha, S.
Sorokin, I.
Tyukin, A.
Bruch, D. vom
Wauters, F.
Wiedner, D.
Zimmermann, M.
JOURNAL OF INSTRUMENTATION, 2016, 11

← 1 2 3 4 5 →