A 280 GHz Stacked-FET Power Amplifier Cell using 50 nm Metamorphic HEMT Technology

被引:0
|
作者
Amado-Rey, B. [1 ]
Campos-Roca, Y. [2 ]
Friesicke, C. [1 ]
Tessmann, A. [1 ]
Lozar, R. [1 ]
Wagner, S. [1 ]
Leuther, A. [1 ]
Schlechtweg, M. [1 ]
Ambacher, O. [1 ]
机构
[1] Fraunhofer Inst Appl Solid State Phys IAF, Freiburg, Germany
[2] Univ Extremadura, Dept Comp & Commun Technol, Caceres, Spain
关键词
Monolithic microwave integrated circuit (MMIC); grounded coplanar waveguide (GCPW); stacked-FET; metamorphic high electron mobility transistors (mHEMT);
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper demonstrates the first stacked-FET monolithic microwave integrated circuit (MMIC) power amplifier cell operating at 280 GHz. Three different circuits were fabricated using 50 nm gate length metamorphic high electron mobility transistors (mHEMT) in combination with grounded coplanar waveguide (GCPW) lines with 14 mu m ground-to-ground spacing. First, cascode and stacked-FET configurations at 240 GHz are compared. The stacked configuration exhibits a more broadband small-signal gain response and a 1.3 dB enhancement of output power compared to the cascode cell. Subsequently, a power amplifier cell for operation at 280 GHz was designed and realized. The stacked-FET configuration is chosen due to its superior performance. The 280 GHz power cell demonstrates more than 8.3 dB of small-signal gain from 267 to 302 GHz (12.3%), with a maximum gain of 9.6 dB at 282 GHz, and an output-referred 2 dB compression point of 3.5 dBm.
引用
收藏
页码:189 / 192
页数:4
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