A 280 GHz Stacked-FET Power Amplifier Cell using 50 nm Metamorphic HEMT Technology

被引:0
|
作者
Amado-Rey, B. [1 ]
Campos-Roca, Y. [2 ]
Friesicke, C. [1 ]
Tessmann, A. [1 ]
Lozar, R. [1 ]
Wagner, S. [1 ]
Leuther, A. [1 ]
Schlechtweg, M. [1 ]
Ambacher, O. [1 ]
机构
[1] Fraunhofer Inst Appl Solid State Phys IAF, Freiburg, Germany
[2] Univ Extremadura, Dept Comp & Commun Technol, Caceres, Spain
关键词
Monolithic microwave integrated circuit (MMIC); grounded coplanar waveguide (GCPW); stacked-FET; metamorphic high electron mobility transistors (mHEMT);
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper demonstrates the first stacked-FET monolithic microwave integrated circuit (MMIC) power amplifier cell operating at 280 GHz. Three different circuits were fabricated using 50 nm gate length metamorphic high electron mobility transistors (mHEMT) in combination with grounded coplanar waveguide (GCPW) lines with 14 mu m ground-to-ground spacing. First, cascode and stacked-FET configurations at 240 GHz are compared. The stacked configuration exhibits a more broadband small-signal gain response and a 1.3 dB enhancement of output power compared to the cascode cell. Subsequently, a power amplifier cell for operation at 280 GHz was designed and realized. The stacked-FET configuration is chosen due to its superior performance. The 280 GHz power cell demonstrates more than 8.3 dB of small-signal gain from 267 to 302 GHz (12.3%), with a maximum gain of 9.6 dB at 282 GHz, and an output-referred 2 dB compression point of 3.5 dBm.
引用
收藏
页码:189 / 192
页数:4
相关论文
共 50 条
  • [41] High Linearity and High Efficiency Stacked-FET Millimeter-Wave Power Amplifier ICs
    Yoshimasu, Toshihiko
    Fang, Mengchu
    Sugiura, Tsuyoshi
    [J]. 2020 IEEE INTERNATIONAL SYMPOSIUM ON RADIO-FREQUENCY INTEGRATION TECHNOLOGY (RFIT), 2020, : 172 - 174
  • [42] An Ultra Compact Watt-Level Ka-Band Stacked-FET Power Amplifier
    Nguyen, Duy P.
    Anh-Vu Pham
    [J]. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2016, 26 (07) : 516 - 518
  • [43] A Watt-Level Stacked-FET Linear Power Amplifier in Silicon-on-Insulator CMOS
    Pornpromlikit, Sataporn
    Jeong, Jinho
    Presti, Calogero D.
    Scuderi, Antonino
    Asbeck, Peter M.
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2010, 58 (01) : 57 - 64
  • [44] A 26.5-40 GHz Stacked Power Amplifier in 130 nm SiGe BiCMOS Technology
    Zhang, Chi
    Li, Zhiqun
    Cheng, Guoxiao
    Wang, Huan
    Li, Zhennan
    [J]. PROCEEDINGS OF 2018 IEEE INTERNATIONAL CONFERENCE ON INTEGRATED CIRCUITS, TECHNOLOGIES AND APPLICATIONS (ICTA 2018), 2018, : 36 - 37
  • [45] D-band Amplifier Using Metamorphic HEMT Technology
    Baek, Yong-Hyun
    Choi, Seok-Gyu
    Lee, Sang-Jin
    Baek, Tae-Jong
    Han, Min
    Oh, Jung-Hun
    Cho, Hui-chul
    Rhee, Eung-Ho
    Rhee, Jin-Koo
    [J]. APMC: 2008 ASIA PACIFIC MICROWAVE CONFERENCE (APMC 2008), VOLS 1-5, 2008, : 3147 - 3150
  • [46] A High Efficiency High Power Density Harmonic-tuned Ka Band Stacked-FET GaAs Power Amplifier
    Nguyen, Duy P.
    Thanh Pham
    Pham, Binh L.
    Anh-Vu Pham
    [J]. 2016 IEEE COMPOUND SEMICONDUCTOR INTEGRATED CIRCUIT SYMPOSIUM (CSICS), 2016, : 158 - 161
  • [47] A 44.3% Peak PAE 25-GHz Stacked-FET Linear Power Amplifier IC With A Varactor-Based Novel Adaptive Load Circuit in 45 nm CMOS SOI
    Sugiura, Tsuyoshi
    Fang, Mengchu
    Yoshimasu, Toshihiko
    [J]. 2021 IEEE ASIA-PACIFIC MICROWAVE CONFERENCE (APMC), 2021, : 181 - 183
  • [48] A Wideband Millimeter-Wave Differential Stacked-FET Power Amplifier with 17.3 dBm Output Power and 25% PAE in 45nm SOI CMOS
    Xia, Jingjing
    Chung, Arthur
    Boumaiza, Slim
    [J]. 2017 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS), 2017, : 1691 - 1694
  • [49] MONOLITHIC 50 GHZ GAAS-FET POWER-AMPLIFIER
    CAMILLERI, N
    CHYE, P
    PRIORIELLO, R
    [J]. GAAS IC SYMPOSIUM /: TECHNICAL DIGEST 1989, 1989, : 267 - 270
  • [50] 300-GHz Amplifier in 75-nm InP HEMT Technology
    Matsumura, Hiroshi
    Kawano, Yoichi
    Shiba, Shoichi
    Sato, Masaru
    Suzuki, Toshihide
    Nakasha, Yasuhiro
    Takahashi, Tsuyoshi
    Makiyama, Kozo
    Iwai, Taisuke
    Hara, Naoki
    [J]. IEICE TRANSACTIONS ON ELECTRONICS, 2016, E99C (05): : 528 - 534