A High Gain 600 GHz Amplifier TMIC Using 35 nm Metamorphic HEMT Technology

被引:21
|
作者
Tessmann, A. [1 ]
Leuther, A. [1 ]
Massler, H. [1 ]
Seelmann-Eggebert, M. [1 ]
机构
[1] Fraunhofer Inst Appl Solid State Phys IAF, Tullastr 72, D-79108 Freiburg, Germany
关键词
airbridge type transmission line (ABTL); benzocyclobutene (BCB); grounded coplanar waveguide (GCPW); metamorphic high electron mobility transistor (mHEMT); submillimeter-wave amplifier; terahertz monolithic integrated circuit (TMIC); WR-1.5 waveguide band;
D O I
10.1109/CSICS.2012.6340102
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, we are presenting two terahertz monolithic integrated circuits (TMICs) for use in next-generation radar and spectroscopy systems operating in the WR-1.5 waveguide band (500 - 750 GHz). Both amplifier circuits have been realized using a 35 nm InAlAs/InGaAs based metamorphic high electron mobility transistor (mHEMT) technology in combination with a benzocyclobutene (BCB) encapsulation to minimize the device parasitics. Furthermore, airbridge type transmission lines (ABTL) and grounded coplanar circuit topology (GCPW) were applied, leading to a compact chip size and excellent gain performance in the submillimeter-wave frequency regime beyond 500 GHz. A realized six-stage ABTL amplifier circuit demonstrated a small-signal gain of more than 20 dB between 502 and 516 GHz, while a six-stage grounded coplanar TMIC achieved a linear gain of 20.3 dB at 610 GHz and more than 18 dB over the bandwidth from 557 to 616 GHz. The total chip size of both submillimeter-wave amplifier circuits was only 0.15 mm(2).
引用
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页数:4
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