Introduction to the Special Issue on the 2020 IEEE International Solid-State Circuits Conference (ISSCC)

被引：0

作者：

Gerfers, Friedel ^{[1
]}

Hsieh, Ping-Hsuan ^{[2
]}

Markovc, Dejan ^{[3
]}

Deguchi, Jun ^{[4
]}

Karl, Eric ^{[5
]}

机构：

[1] Tech Univ Berlin, Chair Mixed Signal Circuit Design, D-10587 Berlin, Germany

[2] Natl Tsing Hua Univ, Dept Elect Engn, Hsinchu 30013, Taiwan

[3] Univ Calif Los Angeles, Dept Elect & Comp Engn, Los Angeles, CA 90024 USA

[4] Kioxia Corp, Kawasaki, Kanagawa 2128520, Japan

[5] Intel Corp, Portland, OR 97239 USA

来源：

IEEE JOURNAL OF SOLID-STATE CIRCUITS | 2021年 / 56卷 / 01期

关键词：

All Open Access; Bronze;

D O I：

10.1109/JSSC.2020.3037445

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This Special Issue of the IEEE Journal of Solid-State Circuits is dedicated to a collection of the best articles selected from the 2020 IEEE International Solid-State Circuits Conference (ISSCC) that took place on February 16-20, 2020, in San Francisco, CA, USA. This Special Issue covers articles from the Wireline, Digital Circuits, Digital Architectures and Systems (DASs), Machine Learning and AI, and Memory Committees.

引用

页码：3 / 6

页数：4

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