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Introduction to the Special Issue on the 2020 IEEE International Solid-State Circuits Conference (ISSCC)
被引:0
|作者:
Gerfers, Friedel
[1
]
Hsieh, Ping-Hsuan
[2
]
Markovc, Dejan
[3
]
Deguchi, Jun
[4
]
Karl, Eric
[5
]
机构:
[1] Tech Univ Berlin, Chair Mixed Signal Circuit Design, D-10587 Berlin, Germany
[2] Natl Tsing Hua Univ, Dept Elect Engn, Hsinchu 30013, Taiwan
[3] Univ Calif Los Angeles, Dept Elect & Comp Engn, Los Angeles, CA 90024 USA
[4] Kioxia Corp, Kawasaki, Kanagawa 2128520, Japan
[5] Intel Corp, Portland, OR 97239 USA
关键词:
All Open Access;
Bronze;
D O I:
10.1109/JSSC.2020.3037445
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
This Special Issue of the IEEE Journal of Solid-State Circuits is dedicated to a collection of the best articles selected from the 2020 IEEE International Solid-State Circuits Conference (ISSCC) that took place on February 16-20, 2020, in San Francisco, CA, USA. This Special Issue covers articles from the Wireline, Digital Circuits, Digital Architectures and Systems (DASs), Machine Learning and AI, and Memory Committees.
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页码:3 / 6
页数:4
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