Introduction to the Special Issue on the 2020 IEEE International Solid-State Circuits Conference (ISSCC)

被引:0
|
作者
Gerfers, Friedel [1 ]
Hsieh, Ping-Hsuan [2 ]
Markovc, Dejan [3 ]
Deguchi, Jun [4 ]
Karl, Eric [5 ]
机构
[1] Tech Univ Berlin, Chair Mixed Signal Circuit Design, D-10587 Berlin, Germany
[2] Natl Tsing Hua Univ, Dept Elect Engn, Hsinchu 30013, Taiwan
[3] Univ Calif Los Angeles, Dept Elect & Comp Engn, Los Angeles, CA 90024 USA
[4] Kioxia Corp, Kawasaki, Kanagawa 2128520, Japan
[5] Intel Corp, Portland, OR 97239 USA
关键词
All Open Access; Bronze;
D O I
10.1109/JSSC.2020.3037445
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This Special Issue of the IEEE Journal of Solid-State Circuits is dedicated to a collection of the best articles selected from the 2020 IEEE International Solid-State Circuits Conference (ISSCC) that took place on February 16-20, 2020, in San Francisco, CA, USA. This Special Issue covers articles from the Wireline, Digital Circuits, Digital Architectures and Systems (DASs), Machine Learning and AI, and Memory Committees.
引用
收藏
页码:3 / 6
页数:4
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