FRACTURE ANALYSIS OF THERMAL BARRIER COATING SYSTEMS UNDER THERMAL SHOCK

被引:1
|
作者
Zhang Yan-Yan [1 ,3 ]
Shen Ri-Lin [2 ]
Huang Kai [2 ]
Yue Xiao-Ning [1 ]
机构
[1] Shenyang Univ, Dept Phys, Shenyang 110000, Peoples R China
[2] Harbin Inst Technol, Sch Astronaut, Harbin 150001, Peoples R China
[3] Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110000, Peoples R China
关键词
Thermal barrier coatings (TBCs); Interaction energy integral method (IEIM); Transient thermal stress intensity factors (TSIFs); Crack growth law; STRESS INTENSITY FACTORS; INTERFACE CRACK;
D O I
10.13168/cs.2016.0061
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
In order to understand the thermal fracture properties of thermal barrier coating (IBC) systems, transient thermal stress intensity factors (TSIFs) are calculated by using the transient interaction energy integral method (IEIM) when a thermal shock load is applied. In this study, continuous and weak interfaces are studied. considering different distributions of the material properties and their derivatives in the interface. The effect of the interface bonding strength on TSIFs at crack tip of TBC systems with multiple interfaces is analysed. This method provides an avenue to simulate interfacial properties subjected to thermal shock loads.
引用
收藏
页码:59 / 64
页数:6
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