Modeling the temperature distribution of multi-chip integrated circuits combining Wire-Bond and Flip-Chip technologies

被引：0

作者：

Boriskov, P. P. ^{[1
]}

Ershova, N. Yu ^{[1
]}

Putrolaynen, V. V. ^{[1
]}

Seredov, P. N. ^{[1
]}

Belyaev, M. A. ^{[1
]}

机构：

[1] Petrozavodsk State Univ, Inst Phys & Technol, 33 Lenin Str, Petrozavodsk 185910, Russia

来源：

INTERNATIONAL SCIENTIFIC CONFERENCE ON APPLIED PHYSICS, INFORMATION TECHNOLOGIES AND ENGINEERING (APITECH-2019) | 2019年 / 1399卷

关键词：

D O I：

10.1088/1742-6596/1399/2/022036

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

On the basis of finite-element computer modeling, the temperature distribution of a multi-chip integrated circuit was calculated in System on Package configuration, combining Wire-Bond and Flip-Chip technologies. Technical recommendations are suggested for choosing a compound, taking into account the continuous layer of the compound separating the active elements and the heat sink.

引用

页数：5

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