Modeling the temperature distribution of multi-chip integrated circuits combining Wire-Bond and Flip-Chip technologies

被引：0
|
作者：
Boriskov, P. P. [1 ]
Ershova, N. Yu [1 ]
Putrolaynen, V. V. [1 ]
Seredov, P. N. [1 ]
Belyaev, M. A. [1 ]
机构：
[1] Petrozavodsk State Univ, Inst Phys & Technol, 33 Lenin Str, Petrozavodsk 185910, Russia
来源：
INTERNATIONAL SCIENTIFIC CONFERENCE ON APPLIED PHYSICS, INFORMATION TECHNOLOGIES AND ENGINEERING (APITECH-2019) | 2019年 / 1399卷
关键词：
D O I：
10.1088/1742-6596/1399/2/022036
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
On the basis of finite-element computer modeling, the temperature distribution of a multi-chip integrated circuit was calculated in System on Package configuration, combining Wire-Bond and Flip-Chip technologies. Technical recommendations are suggested for choosing a compound, taking into account the continuous layer of the compound separating the active elements and the heat sink.
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页数：5
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