3D PRINTED RF PASSIVE COMPONENTS BY LIQUID METAL FILLING

被引：0

作者：

Yang, Chen ^{[1
]}

Wu, Sung-Yueh ^{[1
,2
]}

Glick, Casey ^{[1
]}

Choi, Yun Seok ^{[3
]}

Hsu, Wensyang ^{[2
]}

Lin, Liwei ^{[1
]}

机构：

[1] Univ Calif Berkeley, Berkeley, CA 94720 USA

[2] Natl Chiao Tung Univ, Hsinchu 30050, Taiwan

[3] Samsung Elect Co Ltd, Hwaseong Si, South Korea

来源：

2015 28TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2015) | 2015年

关键词：

MICROFLUIDIC DEVICES; LAB;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We present three-dimensional (3D) micro-scale electrical components and systems by means of 3D printing and a liquid-metal-filling technique. The 3D supporting polymer structures with hollow channels and cavities are fabricated from inkjet printing. Liquid metals made of silver particles suspension in this demonstration are then injected into the hollow paths and solidified to form metallic elements and interconnects with high electrical conductivity. In the proof-of-concept demonstrations, various radio-frequency (RF) passive components, including 3D-shaped inductors, capacitors and resistors are fabricated and characterized. High-Q inductors and capacitors up to 1 GHz have been demonstrated. This work establishes an innovative way to construct arbitrary 3D electrical systems with efficient and labor-saving processes.

引用

页码：261 / 264

页数：4

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