Investigation of temperature and strain rate behavior of lead-free solder Sn96.5Ag3.5

被引：0
|
作者：
Zhu, F. L. [1 ]
Zhang, H. H. [1 ]
Guan, R. F. [1 ]
Liu, S. [1 ,2 ]
Yang, Y. B. [3 ]
机构：
[1] Huazhong Univ Sci & Technol, Sch Mech Sci & Engn, Inst Microsyst, 1037 Luoyu Rd, Wuhan 430074, Hubei, Peoples R China
[2] Wayne State Univ, Dept Mech Engn, Detroit, MI 48202 USA
[3] Nanyang Technol Univ, Mech Machines Lab, Singapore 639798, Singapore
来源：
IPFA 2006: PROCEEDINGS OF THE 13TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITS | 2006年
基金：
国家高技术研究发展计划(863计划);
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：239 / +
页数：2
相关论文
共 50 条
  • [41] Creep behavior of eutectic Sn-Ag lead-free solder alloy
    Huang, ML
    Wang, L
    Wu, CML
    JOURNAL OF MATERIALS RESEARCH, 2002, 17 (11) : 2897 - 2903
  • [42] Effect of strain rate on mechanical behavior of lead-free solder joints
    An, Tong
    Qin, Fei
    Wang, Xiaoliang
    Hanjie Xuebao/Transactions of the China Welding Institution, 2013, 34 (10): : 59 - 62
  • [43] Electrodeposition of eutectic Sn96.5Ag3.5 films from iodide-pyrophosphate solution
    Venkatasamy, V.
    Riemer, S.
    Tabakovic, I.
    ELECTROCHIMICA ACTA, 2011, 56 (13) : 4834 - 4840
  • [44] Prediction of stress-strain relationship with an improved Anand constitutive model for lead-free solder Sn-3.5Ag
    Chen, X
    Chen, G
    Sakane, M
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2005, 28 (01): : 111 - 116
  • [45] Indentation creep of lead-free Sn-3.5Ag solder alloy: Effects of cooling rate and Zn/Sb addition
    Mahmudi, R.
    Pourmajidian, M.
    Geranmayeh, A. R.
    Gorgannejad, S.
    Hashemizadeh, S.
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2013, 565 : 236 - 242
  • [46] Intermetallics evolution in Sn-3.5Ag based lead-free solder matrix on an OSPCu finish
    Gao, Feng
    Nishikawa, Hiroshi
    Takemoto, Tadashi
    JOURNAL OF ELECTRONIC MATERIALS, 2007, 36 (12) : 1630 - 1634
  • [47] Effect of Ag3Sn on Fracture Behaviors of Sn-3.5Ag Lead-Free Solder during In Situ Tensile Test at Low Temperature
    Zhao, Xiangxi
    Zhang, Wei
    Liu, Wei
    Hang, Chunjin
    Tian, Yanhong
    JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2024, 33 (16) : 8236 - 8241
  • [48] Interface behavior and performance of Sn–Ag–Cu lead-free solder bearing Tb
    Zeyu Yuan
    Yujie He
    Ruize Wu
    Ming Xu
    Jun Zhang
    Yunqing Zhu
    Qiaoli Wang
    Weibin Xie
    Huiming Chen
    Journal of Materials Science: Materials in Electronics, 2022, 33 : 20769 - 20777
  • [49] Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder
    Y.D. Han
    H.Y. Jing
    S.M.L. Nai
    L.Y. Xu
    C.M. Tan
    J. Wei
    Journal of Electronic Materials, 2010, 39 : 223 - 229
  • [50] Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder
    Han, Y. D.
    Jing, H. Y.
    Nai, S. M. L.
    Xu, L. Y.
    Tan, C. M.
    Wei, J.
    JOURNAL OF ELECTRONIC MATERIALS, 2010, 39 (02) : 223 - 229
12345