Investigation of temperature and strain rate behavior of lead-free solder Sn96.5Ag3.5

被引：0
|
作者：
Zhu, F. L. [1 ]
Zhang, H. H. [1 ]
Guan, R. F. [1 ]
Liu, S. [1 ,2 ]
Yang, Y. B. [3 ]
机构：
[1] Huazhong Univ Sci & Technol, Sch Mech Sci & Engn, Inst Microsyst, 1037 Luoyu Rd, Wuhan 430074, Hubei, Peoples R China
[2] Wayne State Univ, Dept Mech Engn, Detroit, MI 48202 USA
[3] Nanyang Technol Univ, Mech Machines Lab, Singapore 639798, Singapore
来源：
IPFA 2006: PROCEEDINGS OF THE 13TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITS | 2006年
基金：
国家高技术研究发展计划(863计划);
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：239 / +
页数：2
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