Noise performance of 0.13μm CMOS technologies for detector front-end applications

被引:15
|
作者
Manghisoni, Massimo [1 ]
Ratti, Lodovico
Re, Valerio
Speziali, Valeria
Traversi, Gianluca
机构
[1] Univ Bergamo, Dipartimento Ingn Ind, I-24044 Dalmine, BG, Italy
[2] Univ Pavia, Dipartimento Elettr, I-27100 Pavia, Italy
关键词
CMOS; deep submicron; front-end electronics; noise;
D O I
10.1109/TNS.2006.876472
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Submicron CMOS technologies provide well-established solutions to the implementation of low noise front-end electronics for a wide range of detector applications. In recent years high performance mixed signal circuits were fabricated in 0.35 mu m and 0.25 mu m processes. Presently the IC designers' effort is gradually shifting to 0.13 mu m technologies, following the trend of commercial silicon foundries. Since commercial CMOS processes maintain a steady trend in device scaling, it is essential to monitor the impact of these technological advances on the noise parameters of the devices. To estimate the noise limits of a front-end system in the 0.13 mu m node, this work presents the results of noise measurements carried out on NMOS and PMOS devices in two commercial processes from different foundries. The behavior of the 1/f and white noise terms is studied as a function of the device polarity and of the gate length and width to account for different detector requirements. The study is focused on low current density applications where devices are biased in weak or moderate inversion. Data obtained from the measurements provide a powerful tool to model noise parameters and establish front-end design criteria in a 0.13 mu m CMOS process.
引用
收藏
页码:2456 / 2462
页数:7
相关论文
共 50 条
  • [31] A TRPC-UWB Transmitter Front-end Based on Wideband IQ Modulator in 0.13-μm CMOS
    Huo, Yiming
    Dong, Xiaodai
    Lu, Ping
    2014 12TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT), 2014,
  • [32] A K-band transmitter front-end based on differential switches in 0.13-μm CMOS technology
    Wang H.-C.
    Juang J.-C.
    Lu C.-L.
    Progress In Electromagnetics Research C, 2011, 19 : 61 - 72
  • [33] A CMOS 0.13μm Read-Out Front-End for Triple-Gas-Electron-Multiplier Detectors
    Pezzotta, A.
    Costantini, A.
    De Blasi, M.
    De Matteis, M.
    Gorini, G.
    Murtas, F.
    Baschirotto, A.
    2013 5TH IEEE INTERNATIONAL WORKSHOP ON ADVANCES IN SENSORS AND INTERFACES (IWASI), 2013, : 65 - 70
  • [34] The 0.25 μm front-end for the CMS pixel detector
    Erdmann, W
    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT, 2005, 549 (1-3): : 153 - 156
  • [35] A 0.13-μm CMOS ultra-low power front-end receiver for wireless sensor networks
    Chen, Wenjian
    Copani, Tino
    Bamaby, Hugh J.
    Kiael, Sayfe
    2007 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS (RFIC) SYMPOSIUM, DIGEST OF PAPERS, 2007, : 105 - +
  • [36] A cost-effective digital front-end realization for 20-bit ΣΔ DAC in 0.13μm CMOS
    Chen, Run
    Liu, Liyuan
    Li, Dongmei
    PROCEEDINGS OF THE IEEE 2007 CUSTOM INTEGRATED CIRCUITS CONFERENCE, 2007, : 447 - +
  • [37] A 15μW 12-bit Dynamic Range Charge Measuring Front-End in 0.13μm CMOS
    Kugathasan, T.
    Mazza, G.
    Rivetti, A.
    Toscano, L.
    2010 IEEE NUCLEAR SCIENCE SYMPOSIUM CONFERENCE RECORD (NSS/MIC), 2010, : 1667 - 1673
  • [38] A fully integrated low-power CMOS particle detector front-end for space applications
    Vandenbussche, J
    Leyn, F
    Van der Plas, G
    Gielen, G
    Sansen, W
    IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 1998, 45 (04) : 2272 - 2278
  • [39] A 1-V Low-Noise Readout Front-End for Biomedical Applications in 0.18-μm CMOS
    Chou, Chien-Jung
    Kuo, Bing-Jye
    Chen, Li-Guang
    Hsiao, Po-Yun
    Lin, Tsung-Hsien
    2010 INTERNATIONAL SYMPOSIUM ON VLSI DESIGN AUTOMATION AND TEST (VLSI-DAT), 2010, : 295 - 298
  • [40] A 6-7 GHz,40 dB receiver RF front-end with 4.5 dB minimum noise figure in 0.13μm CMOS for IR-UWB applications
    秦希
    黄煜梅
    洪志良
    Journal of Semiconductors, 2013, 34 (03) : 90 - 96