Measurement of thermal expansion coefficients by electronic speckle pattern interferometry at high temperature

被引：14
|
作者：
Kim, KS
Kim, JH
Lee, JK
Jarng, SS
机构：
[1] CHOSUN UNIV,DEPT MAT ENGN,KWANGJU 501759,SOUTH KOREA
[2] CHOSUN UNIV,DEPT CONTROL & MEASUREMENT ENGN,KWANGJU 501759,SOUTH KOREA
来源：
JOURNAL OF MATERIALS SCIENCE LETTERS | 1997年 / 16卷 / 21期
关键词：
D O I：
10.1023/A:1018527525996
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
[No abstract available]
引用
收藏
页码：1753 / 1756
页数：4
相关论文
共 50 条
  • [41] Residual Stress Measurement of Flat Welded Specimen by Electronic Speckle Pattern Interferometry
    Chang, Ho-Seob
    Kim, Dong-Soo
    Jung, Hyun-Chul
    Kim, Kyung-Suk
    [J]. JOURNAL OF THE KOREAN SOCIETY FOR NONDESTRUCTIVE TESTING, 2012, 32 (02) : 149 - 154
  • [42] Measurement of creep strain in polymers by means of electronic speckle pattern shearing interferometry
    Benito Pascual-Francisco, Juan
    Susarrey-Huerta, Orlando
    Michtchenko, Alexandre
    Barragan-Perez, Omar
    [J]. DIMENSIONAL OPTICAL METROLOGY AND INSPECTION FOR PRACTICAL APPLICATIONS VII, 2018, 10667
  • [43] Review of Electronic Speckle Pattern Interferometry (ESPI) for Three Dimensional Displacement Measurement
    Yang Lianxiang
    Xie Xin
    Zhu Lianqing
    Wu Sijin
    Wang Yonghong
    [J]. CHINESE JOURNAL OF MECHANICAL ENGINEERING, 2014, 27 (01) : 1 - 13
  • [44] Review of Electronic Speckle Pattern Interferometry(ESPI) for Three Dimensional Displacement Measurement
    YANG Lianxiang
    XIE Xin
    ZHU Lianqing
    WU Sijin
    WANG Yonghong
    [J]. Chinese Journal of Mechanical Engineering, 2014, 27 (01) : 1 - 13
  • [45] Review of electronic speckle pattern interferometry (ESPI) for three dimensional displacement measurement
    Lianxiang Yang
    Xin Xie
    Lianqing Zhu
    Sijin Wu
    Yonghong Wang
    [J]. Chinese Journal of Mechanical Engineering, 2014, 27 : 1 - 13
  • [46] Review of Electronic Speckle Pattern Interferometry(ESPI) for Three Dimensional Displacement Measurement
    YANG Lianxiang
    XIE Xin
    ZHU Lianqing
    WU Sijin
    WANG Yonghong
    [J]. Chinese Journal of Mechanical Engineering, 2014, (01) : 1 - 13
  • [47] Evaluation of high frequency vibrations using electronic speckle pattern interferometry
    Toal, V
    Rice, H
    Meskell, C
    Armstrong, C
    Bowe, B
    [J]. OPTO-IRELAND 2002: OPTICS AND PHOTONICS TECHNOLOGIES AND APPLICATIONS, PTS 1 AND 2, 2003, 4876 : 1054 - 1063
  • [48] Thermal contraction coefficient measurement technique of several materials at low temperatures using electronic speckle pattern interferometry
    Nakahara, S
    Nishida, S
    Hisada, S
    Fujita, T
    [J]. ADVANCES IN CRYOGENIC ENGINEERING MATERIALS, VOL 44, PTS A AND B, 1998, 44 : 359 - 366
  • [49] Recent developments in electronic speckle pattern interferometry
    Patorski, K
    [J]. 12TH CZECH-SLOVAK-POLISH OPTICAL CONFERENCE ON WAVE AND QUANTUM ASPECTS OF CONTEMPORARY OPTICS, 2001, 4356 : 124 - 132
  • [50] Holography and electronic speckle pattern interferometry in geophysics
    Takemoto, S
    [J]. OPTICS AND LASERS IN ENGINEERING, 1996, 24 (2-3) : 145 - 160
12345