Large-scale production of nano-twinned, ultrafine-grained copper

被引:80
|
作者
Hodge, A. M.
Wang, Y. M.
Barbee, T. W., Jr.
机构
[1] Lawrence Livermore Natl Lab, Mat Sci & Technol Div, Livermore, CA 94550 USA
[2] Lawrence Livermore Natl Lab, Nanoscale Synth & Characterizat Lab, Livermore, CA 94550 USA
关键词
ultrafine-grained copper; nano-twinned; multilayers; sputtering;
D O I
10.1016/j.msea.2006.05.109
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Large-scale production of high purity (99.999%), nano-twinned, and ultrafine-grained copper foils (22 mu m thick) was successfully implemented by the use of nanoscale multilayer technology. The process allows the production of up to fourteen 10 cm diameter foils during a single deposition run with high levels of reproducibility. Mechanical tests demonstrate that the strength of the Cu foils (alpha(y) similar to 540-690 MPa) compares favorably to ultratine-grained copper samples produced by other methods. (c) 2006 Elsevier B.V. All rights reserved.
引用
收藏
页码:272 / 276
页数:5
相关论文
共 50 条
  • [21] The influence of the ultrafine-grained structure on passivation of copper
    Syugaev, A. V.
    Pechina, E. A.
    Lyalina, N. V.
    Lomaeva, S. F.
    Mar'in, M. V.
    Reshetnikov, S. M.
    PROTECTION OF METALS AND PHYSICAL CHEMISTRY OF SURFACES, 2014, 50 (07) : 841 - 845
  • [22] Fatigue notch sensitivity of ultrafine-grained copper
    Lukás, P
    Kunz, L
    Svoboda, M
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2005, 391 (1-2): : 337 - 341
  • [23] The Femtosecond Laser Ablation on Ultrafine-Grained Copper
    Jianxun Lu
    Xiaoyu Wu
    Shuangchen Ruan
    Dengji Guo
    Chenlin Du
    Xiong Liang
    Zhaozhi Wu
    Metallurgical and Materials Transactions A, 2018, 49 : 2907 - 2917
  • [24] The Femtosecond Laser Ablation on Ultrafine-Grained Copper
    Lu, Jianxun
    Wu, Xiaoyu
    Ruan, Shuangchen
    Guo, Dengji
    Du, Chenlin
    Liang, Xiong
    Wu, Zhaozhi
    METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2018, 49A (07): : 2907 - 2917
  • [25] The influence of nano-scale surface roughness on bacterial adhesion to ultrafine-grained titanium
    Truong, Vi K.
    Lapovok, Rimma
    Estrin, Yuri S.
    Rundell, Stuart
    Wang, James Y.
    Fluke, Christopher J.
    Crawford, Russell J.
    Ivanova, Elena R.
    BIOMATERIALS, 2010, 31 (13) : 3674 - 3683
  • [26] Tensile mechanical properties of nano-twinned copper containing silver inclusions
    Wang, Lei
    Li, Qian
    Sun, Jia
    Li, Zhiming
    Zheng, Yonggang
    PHYSICA B-CONDENSED MATTER, 2019, 554 : 97 - 101
  • [27] Highly efficient electroplating of (220)-oriented nano-twinned copper in methanesulfonic copper baths
    Wei, Hsiang-Sheng
    Tsou, Hsu
    Ku, Hao-Yu
    Lai, Chi-Yu
    Chen, Shih-Hua
    Lin, Chun-Cheng
    Liu, Shang-Tzu
    Huang, Hung-Yi
    Lu, Ming-Kun
    Liu, Kuan-Ling
    Hu, Chi-Chang
    MATERIALS HORIZONS, 2025, 12 (06) : 2002 - 2013
  • [28] Impurity Effect on Wear Resistance of Ultrafine-Grained Copper
    Yao, Bin
    Han, Zhong
    Lu, Ke
    JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2012, 28 (06) : 481 - 487
  • [29] A comprehensive study on the damage tolerance of ultrafine-grained copper
    Hohenwarter, A.
    Pippan, R.
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2012, 540 : 89 - 96
  • [30] Work hardening of ultrafine-grained copper with nanoscale twins
    Chen, X. H.
    Lu, L.
    SCRIPTA MATERIALIA, 2007, 57 (02) : 133 - 136