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Micromachined chip-scale plasma light source
被引:9
|作者:
Carazzetti, P.
[1
]
Renaud, Ph.
[1
]
Shea, H.
[1
]
机构:
[1] Ecole Polytech Fed Lausanne, CH-1015 Lausanne, Switzerland
关键词:
Plasma;
Interdigitated electrodes;
Anodic bonding;
Hermetic sealing;
Light source;
Impedance matching;
Spectroscopy;
Micromachining;
Aluminum electrodes;
STRUCTURED ELECTRODE ARRAYS;
ELECTRICAL BREAKDOWN;
ATMOSPHERIC-PRESSURE;
FIELD BREAKDOWN;
DEVICES;
TECHNOLOGY;
DISCHARGES;
AIR;
D O I:
10.1016/j.sna.2008.05.028
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
We report on the microfabrication and testing of a chip-scale plasma light source. The device consists of a stack of three anodically bonded Pyrex wafers, which hermetically enclose a gas-filled cavity containing interdigitated Aluminum electrodes. When the electrodes are powered through an impedance matching circuit, these devices have been used to generate stable millimeter-size RF plasma discharges operating continuously for over 24 h in He or At at pressures ranging from 10 to 500 mbar at RF powers of 300-1500 mW. (C) 2008 Elsevier B.V. All rights reserved.
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页码:275 / 280
页数:6
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