Micromachined chip-scale plasma light source

被引：9
|
作者：
Carazzetti, P. [1 ]
Renaud, Ph. [1 ]
Shea, H. [1 ]
机构：
[1] Ecole Polytech Fed Lausanne, CH-1015 Lausanne, Switzerland
来源：
SENSORS AND ACTUATORS A-PHYSICAL | 2009年 / 154卷 / 02期
关键词：
Plasma; Interdigitated electrodes; Anodic bonding; Hermetic sealing; Light source; Impedance matching; Spectroscopy; Micromachining; Aluminum electrodes; STRUCTURED ELECTRODE ARRAYS; ELECTRICAL BREAKDOWN; ATMOSPHERIC-PRESSURE; FIELD BREAKDOWN; DEVICES; TECHNOLOGY; DISCHARGES; AIR;
D O I：
10.1016/j.sna.2008.05.028
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We report on the microfabrication and testing of a chip-scale plasma light source. The device consists of a stack of three anodically bonded Pyrex wafers, which hermetically enclose a gas-filled cavity containing interdigitated Aluminum electrodes. When the electrodes are powered through an impedance matching circuit, these devices have been used to generate stable millimeter-size RF plasma discharges operating continuously for over 24 h in He or At at pressures ranging from 10 to 500 mbar at RF powers of 300-1500 mW. (C) 2008 Elsevier B.V. All rights reserved.
引用
收藏
页码：275 / 280
页数：6
相关论文
共 50 条
  • [21] High spectral purity chip-scale tunable THz radiation source
    Wang, Wenting
    Lu, Ping-Keng
    Vinod, Abhinav Kumar
    McMillan, James
    Yu, Mingbin
    Kwong, Dim-Lee
    Jarrahi, Mona
    Wong, Chee Wei
    2021 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO), 2021,
  • [22] Design of microwave signal source for CS chip-scale atomic clock
    Lei, Ji
    Hui, Zhi Meng
    Wei, Li Xin
    Liang, Tang
    Hai, Qiao Dong
    INTERNATIONAL JOURNAL OF MODERN PHYSICS B, 2017, 31 (07):
  • [23] Chip-scale packaging primer
    Malatesta, James
    Bauer, Ron
    Printed Circuit Design, 2000, 17 (03):
  • [24] Assembly chip-scale packaging
    Young, James L.
    Advanced Packaging, 1996, 5 (01):
  • [25] Chip-scale GaN integration
    Li, K. H.
    Fu, W. Y.
    Choi, H. W.
    PROGRESS IN QUANTUM ELECTRONICS, 2020, 70
  • [26] Chip-scale atomic magnetometer
    Schwindt, PDD
    Knappe, S
    Shah, V
    Hollberg, L
    Kitching, J
    Liew, LA
    Moreland, J
    APPLIED PHYSICS LETTERS, 2004, 85 (26) : 6409 - 6411
  • [27] Flip chip micropallet technology - A chip-scale chip
    Goetz, M
    1998 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES AND HIGH DENSITY PACKAGING, PROCEEDINGS, 1998, : 526 - 530
  • [28] Stacking chip-scale packages
    Goodwin, P
    SOLID STATE TECHNOLOGY, 2005, 48 (06) : 26 - +
  • [29] A Chip-Scale Particle Accelerator
    Calamia, Joseph
    IEEE SPECTRUM, 2011, 48 (03) : 14 - 14
  • [30] Terahertz Chip-scale Systems
    Sengupta, Kaushik
    Saeidi, Hooman
    Lu, Xuyang
    Venkatesh, Suresh
    Wu, Xue
    2020 EUROPEAN CONFERENCE ON OPTICAL COMMUNICATIONS (ECOC), 2020,
12345