Micromachined chip-scale plasma light source

被引：9
|
作者：
Carazzetti, P. [1 ]
Renaud, Ph. [1 ]
Shea, H. [1 ]
机构：
[1] Ecole Polytech Fed Lausanne, CH-1015 Lausanne, Switzerland
来源：
SENSORS AND ACTUATORS A-PHYSICAL | 2009年 / 154卷 / 02期
关键词：
Plasma; Interdigitated electrodes; Anodic bonding; Hermetic sealing; Light source; Impedance matching; Spectroscopy; Micromachining; Aluminum electrodes; STRUCTURED ELECTRODE ARRAYS; ELECTRICAL BREAKDOWN; ATMOSPHERIC-PRESSURE; FIELD BREAKDOWN; DEVICES; TECHNOLOGY; DISCHARGES; AIR;
D O I：
10.1016/j.sna.2008.05.028
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We report on the microfabrication and testing of a chip-scale plasma light source. The device consists of a stack of three anodically bonded Pyrex wafers, which hermetically enclose a gas-filled cavity containing interdigitated Aluminum electrodes. When the electrodes are powered through an impedance matching circuit, these devices have been used to generate stable millimeter-size RF plasma discharges operating continuously for over 24 h in He or At at pressures ranging from 10 to 500 mbar at RF powers of 300-1500 mW. (C) 2008 Elsevier B.V. All rights reserved.
引用
收藏
页码：275 / 280
页数：6
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