Effects of deposition temperature and post-annealing on structure and electrical properties in (La0.5Sr0.5)CoO3 films grown on silicon substrate

被引:7
|
作者
Li, Y. W. [1 ]
Hu, Z. G. [1 ]
Yue, F. Y. [1 ]
Zhou, W. Z. [1 ]
Yang, P. X. [1 ]
Chu, J. H. [1 ,2 ]
机构
[1] E China Normal Univ, Sch Informat Sci & Technol, Key Lab Polar Mat & Devices, Shanghai 200241, Peoples R China
[2] Chinese Acad Sci, Shanghai Inst Tech Phys, Natl Lab Infrared Phys, Shanghai 200083, Peoples R China
来源
基金
中国国家自然科学基金; 中国博士后科学基金;
关键词
PULSED-LASER DEPOSITION; LA0.5SR0.5COO3; THIN-FILMS; OXYGEN STOICHIOMETRY; HETEROSTRUCTURES; TEMPLATE;
D O I
10.1007/s00339-008-4989-x
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
(La0.5Sr0.5)CoO3 (LSCO) thin films have been fabricated on silicon substrate by the pulsed laser deposition method. The effects of substrate temperature and post-annealing condition on the structural and electrical properties are investigated. The samples grown above 650A degrees C are fully crystalline with perovskite structure. The film deposited at 700A degrees C has columnar growth with electrical resistivity of about 1.99x10(-3) Omega cm. The amorphous films grown at 500A degrees C were post-annealed at different conditions. The sample post-annealed at 700A degrees C and 10(-4) Pa has similar microstructure with the sample in situ grown at 700A degrees C and 25 Pa. However, the electrical resistivity of the post-annealed sample is one magnitude higher than that of the in situ grown sample because of the effect of oxygen vacancy. The temperature dependence of resistivity exhibits semiconductor-like character. It was found that post-annealing by rapid thermal process will result in film cracks due to the thermal stress. The results are referential for the applications of LSCO in microelectronic devices.
引用
收藏
页码:721 / 725
页数:5
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