Generation and Recombination Carrier Lifetimes in 4H SiC Epitaxial Wafers

被引:0
|
作者
Chung, G. [1 ]
Lobbda, M. J. [1 ]
Marinella, M. J. [2 ]
Schroder, D. K. [2 ]
Klein, P. B. [3 ]
Isaacs-Smith, T. [4 ]
Williams, J. W. [4 ]
机构
[1] Dow Corning Compound Semicond Solut LLC, Midland, MI 48611 USA
[2] Arizona State Univ, Ctr Solid State Elect Res, Dept Elect Engn & Ctr, Tempe, AZ 85287 USA
[3] Naval Res Lab, Washington, DC 20375 USA
[4] Auburn Univ, Dept Phys, Auburn, AL 36849 USA
关键词
Generation and recombination lifetimes; 4H-SiC; Oxide leakage currents;
D O I
10.4028/www.scientific.net/MSF.600-603.485
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Compared to silicon, there have been relatively few comparative studies of recombination and carrier lifetimes in SiC. For the first time, both generation and recombination carrier lifetimes are reported from the same areas in 20 mu m thick 4H SiC n-/n+ epi-wafer structures. The ratio of the generation to recombination lifetime is much different in SiC compared to Si. Activation energy calculated from SiC generation lifetimes shows that traps with energy levels near mid-gap dominate the generation lifetime. Comparison of both generation and recombination lifetimes and dislocation counts measured in the device area show no correlation in either case.
引用
收藏
页码:485 / +
页数:2
相关论文
共 50 条
  • [41] Neutron irradiation of 4H SiC
    Carlsson, FHC
    Storasta, L
    Magnusson, B
    Berman, JP
    Sköld, K
    Janzén, E
    SILICON CARBIDE AND RELATED MATERIALS, ECSCRM2000, 2001, 353-356 : 555 - 558
  • [42] High Quality Epitaxial Growth on 4° Off-axis 4H SiC with Addition of HCl
    Zhang, Jie
    Mazzola, Janice
    Sunkari, Swapna
    Stewart, Gray
    Klein, Paul B.
    Ward, Rachael M.
    Glaser, Evan
    Lew, Kok-Keong
    Gaskill, D. Kurt
    Sankin, Igor
    Bondarenko, Vlad
    Null, David
    Sheridan, David
    Mazzola, Mike
    SILICON CARBIDE AND RELATED MATERIALS 2007, PTS 1 AND 2, 2009, 600-603 : 103 - +
  • [43] Surface flattening of 4H-SiC (0001) epitaxial wafers by high temperature oxidation
    Zhao, Siqi
    Wang, Jiulong
    Yan, Guoguo
    Shen, Zhanwei
    Zhao, Wanshun
    Wang, Lei
    Liu, Xingfang
    Sun, Guosheng
    Zeng, Yiping
    SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2022, 37 (10)
  • [44] Minority-carrier recombination lifetimes of the frontside and backside of Si wafers subjected to plasma processing
    Itsumi, Manabu
    Journal of Vacuum Science & Technology B: Microelectronics Processing and Phenomena, 1998, 16 (03):
  • [45] Minority-carrier recombination lifetimes of the frontside and backside of Si wafers subjected to plasma processing
    Itsumi, M
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1998, 16 (03): : 1030 - 1033
  • [46] Improvement of Carrier Lifetimes in Highly Al-Doped p-Type 4H-SiC Epitaxial Layers by Hydrogen Passivation
    Okuda, Takafumi
    Kimoto, Tsunenobu
    Suda, Jun
    APPLIED PHYSICS EXPRESS, 2013, 6 (12)
  • [47] X-ray characterization of 3 inch diameter 4H and 6H-SiC experimental wafers
    Kuhr, T.A.
    Vetter, W.M.
    Dudley, M.
    Skowronski, M.
    Materials Science Forum, 2000, 338
  • [48] Carrier lifetimes and recombination-generation mechanisms in semiconductor device physics
    Khanna, VK
    EUROPEAN JOURNAL OF PHYSICS, 2004, 25 (02) : 221 - 237
  • [49] Investigation of electron-hole generation in MOS capacitors on 4H SiC
    Cheong, KY
    Dimitrijev, S
    Han, JS
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2003, 50 (06) : 1433 - 1439
  • [50] X-ray characterization of 3 inch diameter 4H and 6H-SiC experimental wafers
    Kuhr, TA
    Vetter, WM
    Dudley, M
    Skowronski, M
    SILICON CARBIDE AND RELATED MATERIALS - 1999 PTS, 1 & 2, 2000, 338-3 : 473 - 476