Agglomeration and Dendritic Growth of Cu/Ti/Si Thin Film

被引:4
|
作者
Lin, Qi-jing [1 ]
Jing, Weixuan [1 ]
Yang, Shu-ming [1 ,2 ]
Jiang, Zhuang-de [1 ]
Wang, Chen-ying [1 ]
机构
[1] Xi An Jiao Tong Univ, State Key Lab Mech Mfg Syst Engn, Xian 710049, Peoples R China
[2] Huazhong Univ Sci & Technol, State Key Lab Digital Mfg Equipment & Technol, Wuhan 430074, Peoples R China
基金
中国国家自然科学基金;
关键词
SOLID-PHASE INTERACTIONS; MULTIFRACTAL ANALYSIS; SURFACE; CU; TI; MORPHOLOGY; KINETICS; SYSTEM; EXCESS; SI;
D O I
10.1155/2014/518520
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Agglomeration and the transformation from random fractal to dendritic growth have been observed during Cu/Ti/Si thin film annealing. The experimental results show that the annealing temperature, film thickness, and substrate thickness influenced the agglomeration and dendritic growth. Multifractal spectrum is used to characterize the surface morphology quantificationally. The shapes of the multifractal spectra are hook-like to the left. Value of Delta alpha increases with the annealing temperature rising, and Delta f increases from 500 degrees C to 700 degrees C but reduces from 700 degrees C to 800 degrees C. The dendritic patterns with symmetrical branches are generated in the surfaces when the thin films were annealed at 800 degrees C.
引用
收藏
页数:8
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