共 50 条
- [42] 3D COLORED MESH GRAPH SIGNALS MULTI-LAYER MORPHOLOGICAL ENHANCEMENT 2017 IEEE INTERNATIONAL CONFERENCE ON ACOUSTICS, SPEECH AND SIGNAL PROCESSING (ICASSP), 2017, : 1358 - 1362
- [44] 3D Kinetic Monte Carlo Simulation of Electromigration in Multi-layer Interconnects 2019 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES (SISPAD 2019), 2019, : 1 - 4
- [45] SoIC for Low-Temperature, Multi-Layer 3D Memory Integration 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 855 - 860
- [48] Analysis and reduction of the voltage noise of multi-layer 3D IC with multi-paired power delivery network IEICE ELECTRONICS EXPRESS, 2017, 14 (18):
- [50] Mechanism and Performance of 3D Printing and Recycling for Continuous Carbon Fiber Reinforced PLA Composites Jixie Gongcheng Xuebao/Journal of Mechanical Engineering, 2019, 55 (07): : 128 - 134