Preparation and thermal characterization of Carbon Nanotubes-based composites for applications in electronics packaging

被引：2
|
作者：
Toschi, Francesco [1 ]
Tamburri, Emanuela [1 ]
Guglielmotti, Valeria [1 ]
Terranova, Maria Letizia [1 ]
Reale, Andrea [2 ]
Di Carlo, Aldo [2 ]
Passeri, Daniele [3 ]
Rossi, Marco [3 ]
Falessi, Carlo [4 ]
Fiorello, Annamaria [4 ]
Buttiglione, Roberta [4 ]
机构：
[1] Univ Roma Tor Vergata, Dept Chem Sci & Technol, MINAS Lab, Via Ric Sci, I-00133 Rome, Italy
[2] Univ Roma Tor Vergata, Dept Elect Engn, MINAS Lab, I-00133 Rome, Italy
[3] Univ Roma La Sapienza, Dept Energet, Rome, Italy
[4] SELEX Sistemi Integrati SpA, Rome, Italy
来源：
SECOND INTERNATIONAL CONFERENCE ON QUANTUM-, NANO- AND MICRO-TECHNOLOGIES: ICQNM 2008, PROCEEDINGS | 2008年
关键词：
Carbon Nanotubes; Thermal Management; Epoxy Resin; Nanocomposite; TIM; Thermal Interface Materials;
D O I：
10.1109/ICQNM.2008.20
中图分类号：
TP39 [计算机的应用];
学科分类号：
081203 ; 0835 ;
摘要：
The thermal resistance of nanocomposite layers formed by Single Wall Carbon Nanotubes (SWCNT) dispersed in epoxy resins has been measured under conditions similar to the ones used to dissipate heat in microelettronic devices. The variation of thermal conductivity as a function of concentration of SWCNT is reported and discussed with reference to the dispersion state of SWCNT in the layers.
引用
收藏
页码：55 / +
页数：3
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