Tunable photodetector based on GaAs/InP wafer bonding

被引:11
|
作者
Wang, Wenjuan [1 ]
Ren, Xiaomin [1 ]
Huang, Hui [1 ]
Wang, Xingyan [1 ]
Cui, Hailin [1 ]
Miao, Ang [1 ]
Li, Yiqun [1 ]
Huang, Yongqing [1 ]
机构
[1] Beijing Univ Posts & Telecommun, Key Lab Opt Commun & Lightwave Technol Minist Edu, Beijing 100876, Peoples R China
基金
中国国家自然科学基金;
关键词
photodetector; tunable; wafer bonding;
D O I
10.1109/LED.2006.883053
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We demonstrate a tunable long wavelength vertical-cavity photodetector which is fabricated by bonding a-GaAs-based tunable filter with an InP-based absorption structure. The wavelength tuning range of 10.5 nm was achieved via thermal-optic effect. The external quantum efficiency of about 22%, the spectral linewidth as narrow as 0.6 nm, and the 3-dB bandwidth of 12 GHz were obtained in the device.
引用
收藏
页码:827 / 829
页数:3
相关论文
共 50 条
  • [1] TEM study of GaAs/InP heterostructures fabricated by wafer bonding
    Patriarche, G
    Jeannes, F
    Glas, F
    Oudar, JL
    MICROSCOPY OF SEMICONDUCTING MATERIALS 1995, 1995, 146 : 409 - 412
  • [2] Low-temperature direct wafer bonding of GaAs/InP
    Xie, Sheng
    Chen, Songyan
    Guo, Weilian
    Mao, Whong
    SUPERLATTICES AND MICROSTRUCTURES, 2009, 45 (02) : 47 - 53
  • [3] BUBBLE-FREE WAFER BONDING OF GAAS AND INP ON SILICON IN A MICROCLEANROOM
    LEHMANN, V
    MITANI, K
    STENGL, R
    MII, T
    GOSELE, U
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 1989, 28 (12): : L2141 - L2143
  • [4] Room-temperature GaAs/InP wafer bonding with extremely low resistance
    Uchida, Shiro
    Watanabe, Tomomasa
    Yoshida, Hiroshi
    Tange, Takashi
    Arimochi, Masayuki
    Ikeda, Masao
    Dai, Pan
    He, Wei
    Ji, Lian
    Lu, Shulong
    Yang, Hui
    APPLIED PHYSICS EXPRESS, 2014, 7 (11) : 112301
  • [5] Defects, structure, and chemistry of InP-GaAs interfaces obtained by wafer bonding
    Sagalowicz, L
    Rudra, A
    Kapon, E
    Hammar, M
    Salomonsson, F
    Black, A
    Jouneau, PH
    Wipijewski, T
    JOURNAL OF APPLIED PHYSICS, 2000, 87 (09) : 4135 - 4146
  • [6] GAAS TO INP WAFER FUSION
    RAM, RJ
    DUDLEY, JJ
    BOWERS, JE
    YANG, L
    CAREY, K
    ROSNER, SJ
    NAUKA, K
    JOURNAL OF APPLIED PHYSICS, 1995, 78 (06) : 4227 - 4237
  • [7] Wafer bonding of GaAs, InP, and Si annealed without hydrogen for advanced device technologies
    Roberds, BE
    Choquette, KD
    Geib, KM
    Kravitz, SH
    Twesten, RD
    Farrens, SN
    SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY, AND APPLICATIONS IV, 1998, 36 : 592 - 597
  • [8] Transfer of InP epilayers by wafer bonding
    Hjort, K
    JOURNAL OF CRYSTAL GROWTH, 2004, 268 (3-4) : 346 - 358
  • [9] Hybrid-integrated GaAs/GaAs and InP/GaAs semiconductors through wafer bonding technology: Interface adhesion and mechanical strength
    Shi, F
    MacLaren, S
    Xu, CF
    Cheng, KY
    Hsieh, KC
    JOURNAL OF APPLIED PHYSICS, 2003, 93 (09) : 5750 - 5756
  • [10] Low-temperature InP/GaAs wafer bonding using sulfide-treated surface
    Huang, H
    Ren, XM
    Wang, XY
    Wang, Q
    Huang, YQ
    APPLIED PHYSICS LETTERS, 2006, 88 (06)