Power Enhancement of GaN-Based Flip-Chip Light-Emitting Diodes with Triple Roughened Surfaces

被引:5
|
作者
Cheng, Bo-Siao [1 ]
Lee, Chia-En
Kuo, Hao-Chung
Lu, Tien-Chang
Wang, Shing-Chung
机构
[1] Natl Chiao Tung Univ, Dept Photon, Hsinchu 300, Taiwan
关键词
LEDS;
D O I
10.1143/JJAP.48.04C115
中图分类号
O59 [应用物理学];
学科分类号
摘要
The flip-chip light emitting diodes (FC-LEDs) with triple roughened surfaces were fabricated comprising top surface sapphire textured layer, interface patterned sapphire layer, and bottom naturally textured p-GaN layer. Light extraction efficiency was enhanced by such triple textured layers. The light output power of FC-LEDs was increased 60% (at 350 mA current injection) compared to that of conventional FC-LEDs by implementing the triple roughened surfaces. The enhancement efficiency can be simulated and the simulated results showed the same trend as the results of experiment. (C) 2009 The Japan Society of Applied Physics
引用
收藏
页数:3
相关论文
共 50 条
  • [21] Light-extraction enhancement of freestanding GaN-based flip-chip light-emitting diodes using two-step roughening methods
    An Tielei
    Sun Bo
    Wei Tongbo
    Zhao Lixia
    Duan Ruifei
    Liao Yuanxun
    Li Jinmin
    Yi Futing
    JOURNAL OF SEMICONDUCTORS, 2013, 34 (11)
  • [22] Low-resistance Al-based reflectors for high-power GaN-based flip-chip light-emitting diodes
    Song, JO
    Hong, WK
    Park, Y
    Kwak, JS
    Seong, TY
    APPLIED PHYSICS LETTERS, 2005, 86 (13) : 1 - 3
  • [23] Light-extraction enhancement of freestanding GaN-based flip-chip light-emitting diodes using two-step roughening methods
    安铁雷
    孙波
    魏同波
    赵丽霞
    段瑞飞
    廖元勋
    李晋闽
    伊福廷
    Journal of Semiconductors, 2013, (11) : 53 - 56
  • [24] Light-extraction enhancement of freestanding GaN-based flip-chip light-emitting diodes using two-step roughening methods
    安铁雷
    孙波
    魏同波
    赵丽霞
    段瑞飞
    廖元勋
    李晋闽
    伊福廷
    Journal of Semiconductors, 2013, 34 (11) : 53 - 56
  • [25] Performance enhancement of GaN-based flip-chip ultraviolet light-emitting diodes with a RPD AlN nucleation layer on patterned sapphire substrate
    Lin, B. C.
    Chiu, C. H.
    Lee, C. Y.
    Han, H. V.
    Tu, P. M.
    Chen, T. P.
    Li, Z. Y.
    Lee, P. T.
    Lin, C. C.
    Chi, G. C.
    Chen, C. H.
    Fan, B.
    Chang, C. Y.
    Kuo, H. C.
    OPTICAL MATERIALS EXPRESS, 2014, 4 (08): : 1632 - 1640
  • [26] Improved Thermal Stability of GaN-Based Flip-Chip Light-Emitting Diodes with TiW-Based Diffusion Barrier
    Kwak, Joon Seop
    Kang, Ki Man
    Park, Min Joo
    Pyo, Myoungho
    SCIENCE OF ADVANCED MATERIALS, 2014, 6 (10) : 2249 - 2253
  • [27] High-power AlGaInN flip-chip light-emitting diodes
    Wierer, JJ
    Steigerwald, DA
    Krames, MR
    O'Shea, JJ
    Ludowise, MJ
    Christenson, G
    Shen, YC
    Lowery, C
    Martin, PS
    Subramanya, S
    Götz, W
    Gardner, NF
    Kern, RS
    Stockman, SA
    APPLIED PHYSICS LETTERS, 2001, 78 (22) : 3379 - 3381
  • [28] Decoupling contact and mirror: an effective way to improve the reflector for flip-chip InGaN/GaN-based light-emitting diodes
    Zhu, Binbin
    Liu, Wei
    Lu, Shunpeng
    Zhang, Yiping
    Hasanov, Namig
    Zhang, Xueliang
    Ji, Yun
    Zhang, Zi-Hui
    Tan, Swee Tiam
    Liu, Hongfei
    Demir, Hilmi Volkan
    JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2016, 49 (26)
  • [29] Effect of Dielectric Distributed Bragg Reflector on Electrical and Optical Properties of GaN-Based Flip-Chip Light-Emitting Diodes
    Zhou, Shengjun
    Xu, Haohao
    Liu, Mengling
    Liu, Xingtong
    Zhao, Jie
    Li, Ning
    Liu, Sheng
    MICROMACHINES, 2018, 9 (12):
  • [30] Electrical and optical characterization of GaN-based light-emitting diodes fabricated with top-emission and flip-chip structures
    Kim, Hyunsoo
    Lee, Sung-Nam
    Cho, Jaehee
    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2010, 13 (03) : 180 - 184