Delamination behavior of film-substrate systems under cyclic loading

被引：7
|
作者：
Liao, K [1 ]
Wan, KT
机构：
[1] Nanyang Technol Univ, Sch Appl Sci, Singapore 639798, Singapore
[2] Nanyang Technol Univ, Sch Mech & Prod Engn, Singapore 639798, Singapore
来源：
JOURNAL OF MATERIALS SCIENCE LETTERS | 2000年 / 19卷 / 01期
关键词：
D O I：
10.1023/A:1006755916044
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The application of shaft-loaded blister method to study the durability of the film-substrate interface under repeated mechanical loadings was examined. Both quasi-static and cyclic tests were carried out in an Instron Tester using a 50 N load cell. To characterize the propagation of delamination under cyclic loading, a range of displacement levels were chosen around which delamination had initiated under monotonic quasi-static loading. Results confirmed that the shaft-loaded blister test is an effective and efficient method to evaluate the durability of the film-substrate interface.
引用
收藏
页码：57 / 59
页数：3
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