Analysis of Signal Integrity/Power Integrity in Multilayer Printed Circuit Board and Two Improving Methods

被引：1
|
作者：
Kang, Hee-do [1 ]
Kim, Hyun
Yook, Jong-Gwan [1 ]
机构：
[1] Yonsei Univ, Dept Elect & Elect Engn, 134 Shinchon Dong, Seoul 120749, South Korea
来源：
IEEE EDAPS: 2008 ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM | 2008年
关键词：
D O I：
10.1109/EDAPS.2008.4736037
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
The signal integrity (SI) and power integrity (PI) in multilayer printed circuit board is analyzed using three-dimensional (3D) full EM simulation and the circuit simulation. As a result of that, the dominant factor of SI/PI on the test board is noise coupling by GND via. Hence, two methods are applied to suppress the coupling; differential signaling and anti-via structure. Using these two methods, the noise on the signal line and power via can be suppressed, remarkably. Therefore, the SI/PI in multilayer PCB can be guaranteed to the low noise level.
引用
收藏
页码：210 / +
页数：2
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