Power Integrity Analysis of FPGA Heterogeneous Accelerate Board

被引：0
|
作者：
Yang Z. [1 ,2 ]
Kan H.-W. [1 ]
Liu T.-J. [1 ]
Zhang C. [1 ]
机构：
[1] Architecture Research Department, Inspur Group Company Limited, Jinan
[2] State Key Laboratory of High-End Server and Storage Technology, Inspur Group Company Limited, Beijing
来源：
| 2018年 / Beijing University of Posts and Telecommunications卷 / 41期
关键词：
Decoupling capacitor; Power distribution network; Power integrity; Target impedance;
D O I：
10.13190/j.jbupt.2017-238
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
A high performance and high density field programmable gate array (FPGA) heterogeneous accelerate board was proposed. Base on target impedance design method, the AC/DC characteristics were analyzed and power integrity post simulation was present. Application on image identification utilized the proposed heterogeneous FPGA accelerate board and performance comparison are given. © 2018, Editorial Department of Journal of Beijing University of Posts and Telecommunications. All right reserved.
引用
收藏
页码：76 / 80
页数：4
相关论文
共 8 条
  • [1] Chandana M., Mervin J., Selvakumar D., Power integrity analysis for high performance design, 2015 International Conference on Control, Electronics, Renewable Energy and Communications (ICCEREC), pp. 48-53, (2015)
  • [2] Lu H., Guo Y., Wei J., Et al., New Uultra-wideband electromagnetic bandgap structure used for simultaneous switching noise suppression, Journal of Beijing University of Posts and Telecommunications, 35, 4, pp. 15-18, (2012)
  • [3] Wang L., Zhang Y., Zhang G., Power integrity analysis for high-speed PCB, 2010 First International Conference on Pervasive Computing, Signal Processing and Applications, pp. 414-418, (2010)
  • [4] Drewniak J., Power integrity concepts for high-speed design on multi-layer PCBs, 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), pp. 1-41, (2017)
  • [5] Khened P.A., Badiger S.D., Power integrity analysis for solid state drive PCB, 2016 International Conference on Emerging Technological Trends (ICETT), pp. 1-4, (2016)
  • [6] Yang Z., Fundamentals of power integrity, 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), pp. 1-50, (2017)
  • [7] Whatmough Paul N., Das S., Hadjilambrou Z., Et al., Power integrity analysis of a 28 nm dual-core ARM Cortex-A57 cluster using an all-digital power delivery monitor, IEEE Journal of Solid-State Circuits, 52, 6, pp. 1643-1654, (2017)
  • [8] Nayak B.P., Vedicherla S.R., Gope D., Nonorthogonal 2.5-D PEEC for power integrity analysis of package-board geometries, IEEE Transactions on Microwave Theory and Techniques, 65, 4, pp. 1203-1214, (2017)
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