Analysis of Signal Integrity/Power Integrity in Multilayer Printed Circuit Board and Two Improving Methods

被引：1

作者：

Kang, Hee-do ^{[1
]}

Kim, Hyun

Yook, Jong-Gwan ^{[1
]}

机构：

[1] Yonsei Univ, Dept Elect & Elect Engn, 134 Shinchon Dong, Seoul 120749, South Korea

来源：

IEEE EDAPS: 2008 ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM | 2008年

关键词：

D O I：

10.1109/EDAPS.2008.4736037

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

The signal integrity (SI) and power integrity (PI) in multilayer printed circuit board is analyzed using three-dimensional (3D) full EM simulation and the circuit simulation. As a result of that, the dominant factor of SI/PI on the test board is noise coupling by GND via. Hence, two methods are applied to suppress the coupling; differential signaling and anti-via structure. Using these two methods, the noise on the signal line and power via can be suppressed, remarkably. Therefore, the SI/PI in multilayer PCB can be guaranteed to the low noise level.

引用

页码：210 / +

页数：2

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