Applications of cold plasma technology in food packaging

被引：354

作者：

Pankaj, S. K. ^{[1
]}

Bueno-Ferrer, C. ^{[1
]}

Misra, N. N. ^{[1
]}

Milosavljevic, V. ^{[1
,2
]}

O'Donnell, C. P. ^{[2
]}

Bourke, P. ^{[1
]}

Keener, K. M. ^{[1
,3
]}

Cullen, P. J. ^{[1
]}

机构：

[1] Dublin Inst Technol, BioPlasma Res Grp, Sch Food Sci & Environm Hlth, Dublin 1, Ireland

[2] Univ Coll Dublin, Dublin 4, Ireland

[3] Purdue Univ, W Lafayette, IN 47907 USA

来源：

TRENDS IN FOOD SCIENCE & TECHNOLOGY | 2014年 / 35卷 / 01期

关键词：

DIELECTRIC BARRIER DISCHARGE; SURFACE MODIFICATION; OXYGEN-PLASMA; ANTIMICROBIAL ACTIVITY; POLYPROPYLENE SURFACE; GLUCOSE-OXIDASE; ELECTRON-BEAM; WATER-VAPOR; GAS PLASMA; AIR PLASMA;

D O I：

10.1016/j.tifs.2013.10.009

中图分类号：

TS2 [食品工业];

学科分类号：

0832 ;

摘要：

Cold plasma technology is an emerging, green process offering many potential applications for food packaging. While it was originally developed to increase the surface energy of polymers, enhancing adhesion and printability, it has recently emerged as a powerful tool for surface decontamination of both foodstuffs and food packaging materials. New trends aim to develop in-package decontamination, offering non-thermal treatment of foods post-packaging. This paper provides an overview of cold plasma theory, equipment and summarises recent advances in the modification of polymeric food packaging materials along with potential applications in the food industry.

引用

页码：5 / 17

页数：13

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