Foundry TSV Enablement For 2.5D/3D Chip Stacking

被引：0
|
作者：
Yu, Remi [1 ]
机构：
[1] UMC, Hot Chips 24, Ljubljana, Slovenia
来源：
2012 IEEE HOT CHIPS 24 SYMPOSIUM (HCS) | 2012年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
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页数：31
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