Foundry TSV Enablement For 2.5D/3D Chip Stacking

被引：0
|
作者：
Yu, Remi [1 ]
机构：
[1] UMC, Hot Chips 24, Ljubljana, Slovenia
来源：
2012 IEEE HOT CHIPS 24 SYMPOSIUM (HCS) | 2012年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页数：31
相关论文
共 50 条
  • [1] A Thin Adhesive for 3D/2.5D Si Chip Stacking at Low Temperature
    Kayaba, Yasuhisa
    Nakamura, Yuzo
    Kozeki, Takashi
    Kamada, Jun
    Kohmura, Kazuo
    IITC2021: 2021 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE (IITC), 2021,
  • [2] Foundry Perspectives on 2.5D/3D Integration and Roadmap
    Yu, Douglas C. H.
    Wang, Chuei-Tang
    Hsia, Harry
    2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2021,
  • [3] Novel TSV Process Technologies for 2.5D/3D Packaging
    Morikawa, Y.
    Murayama, T.
    Sakuishi, T.
    Suzuki, A.
    Nakamuta, Y.
    Suu, K.
    2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 1697 - 1699
  • [4] Automated Inspection and Metrology for 2.5D and 3D/TSV Process Assurance
    Wood, James
    Soler, Vilmarie
    Perfecto, Eric
    Luckenbach, Thomas
    Shoukrun, Aki
    2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 1606 - 1609
  • [5] Imitation chip design based on TSV 2.5D package
    Gao Nayan
    Cao Yuyuan
    Zhu Yuan
    Ming Xuefei
    2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015,
  • [6] Cu/Sn Microbumps Interconnect for 3D TSV Chip Stacking
    Agarwal, Rahul
    Zhang, Wenqi
    Limaye, Paresh
    Labie, Riet
    Dimcic, Biljana
    Phommahaxay, Alain
    Soussan, Philippe
    2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2010, : 858 - 863
  • [7] A Novel Method of Electrical Measurement for Stacking Error in 3D/2.5D Integration
    Lee, Shih-Wei
    Kuo, Shu-Chiao
    Chen, Kuan-Neng
    JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2018, 18 (02) : 1066 - 1069
  • [8] Low COO PVD solutions addressing 2.5D and 3D TSV packaging challenges.
    Auer, Hans
    Hirscher, Hans
    Desjardins, Patrick
    Weichart, Juergen
    2012 35TH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM (IEMT), 2012,
  • [9] TSV Technology for 2.5D IC Solution
    Wang, Meng-Jen
    Hung, Chang-Ying
    Kao, Chin-Li
    Lee, Pao-Nan
    Chen, Chi-Han
    Hung, Chih-Pin
    Tong, Ho-Ming
    2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 284 - 288
  • [10] Material Technology for 2.5D/3D Package
    Mitsukura, Kazuyuki
    Makino, Tatsuya
    Hatakeyama, Keiichi
    Rebibis, Kenneth June
    Wang, Teng
    Capuz, Giovanni
    Duval, Fabrice
    Detalle, Mikael
    Miller, Andy
    Beyne, Eric
    IEEE CPMT SYMPOSIUM JAPAN 2015, (ICSJ 2015), 2015, : 101 - 104
12345