Configurable system simulation model build comprising packaging design data

被引:3
|
作者
Anderson, HW
Kriese, H
Roesner, W
Schubert, KD
机构
[1] IBM Deutschland Entwicklung GmbH, IBM Syst & Technol Grp, D-71032 Boblingen, Germany
[2] IBM Syst & Technol Grp, Austin, TX 78758 USA
关键词
D O I
10.1147/rd.483.0367
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
A high-end eServer(TM) consists of multiple microprocessor chips packaged with additional chips on a multichip module. In conjunction with memory and various I/O cards, this module is mounted on a card called a processor book, and a few of those cards on a board finally represent a major part of the system. Before the first hardware is built, simulations must be performed to verify that all of these components work together. But before we can build the simulation models, we need to find answers to many questions and to specify constraints, such as the scope of the simulation, the representation of the packaging data, the handling of cross-hierarchical connections such as cables, and the handling of passive components such as resistors and capacitors. This system model build should be as flexible as possible. System verification must be done for different system configurations (both single-processor and multiprocessor systems, one-processor book systems, and multiprocessor-book systems) with or without I/O. Therefore, not only should a configurable model build downsize the model structure, but it should provide the capability to add logic. The requirement to include special logic, such as clock macros or checker logic, is driven by the use of emulation and acceleration technology and by other speed-related elements. This paper discusses these new concepts in eServer development: a configurable simulation model build, the automatic derivation of structural model data from packaging design, and the addition of specific logic without affecting the model structure generated by the previous step.
引用
收藏
页码:367 / 378
页数:12
相关论文
共 50 条
  • [31] THE METHODOLOGY FOR THE LOGISTICS SYSTEM SIMULATION MODEL DESIGN
    Malindzak, D.
    Straka, M.
    Helo, P.
    Takala, J.
    METALURGIJA, 2010, 49 (04): : 348 - 352
  • [32] Simulation of packaging design of virtual manufacturing products based on computer vision and Big data
    Min, Xiaoyun
    INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2023,
  • [33] Sustainable packaging design model
    Bucci, Doris Zwicker
    Forcellini, Fernando Antonio
    COMPLEX SYSTEMS CONCURRENT ENGINEERING: COLLABORATION, TECHNOLOGY INNOVATION AND SUSTAINABILITY, 2007, : 363 - +
  • [34] Design, Simulation and Realization of a Parametrizable, Configurable and Modular Asynchronous FIFO
    Ashour, Haytham
    2015 SCIENCE AND INFORMATION CONFERENCE (SAI), 2015, : 1391 - 1395
  • [35] Semantic data model in multibody system simulation
    Kortelainen, J.
    Mikkola, A.
    PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART K-JOURNAL OF MULTI-BODY DYNAMICS, 2010, 224 (K4) : 341 - 352
  • [36] Configurable Data Exchange Tool Design Based on Tagged Data Structure
    Wang Gao-qin
    Xu Jun
    Shao Ping
    2012 CONFERENCE ON POWER & ENERGY - IPEC, 2012, : 311 - 314
  • [37] IMPLEMENTING A DESIGN BUILD PREQUALIFICATION SYSTEM
    POTTER, KJ
    SANVIDO, V
    JOURNAL OF MANAGEMENT IN ENGINEERING, 1995, 11 (03) : 30 - 34
  • [38] Polyvinyl Alcohol Food Packaging System Comprising Green Synthesized Silver Nanoparticles
    Abdelhamid, Ahmed Elsayed
    Yousif, Eman AboBakr Ali
    El-Saidi, Manal Mohamed Talaat
    El-Sayed, Ahmed Ali
    INDONESIAN JOURNAL OF CHEMISTRY, 2021, 21 (02) : 350 - 360
  • [39] Investigating a re-configurable PET system design
    Kao, Chien-Min
    Kim, Heejong
    Chen, Chin-Tu
    2010 IEEE NUCLEAR SCIENCE SYMPOSIUM CONFERENCE RECORD (NSS/MIC), 2010, : 2158 - 2162
  • [40] Design of a configurable system-on-chip for audio application
    Tan, Honghe
    Sun, Yihe
    ASICON 2007: 2007 7TH INTERNATIONAL CONFERENCE ON ASIC, VOLS 1 AND 2, PROCEEDINGS, 2007, : 740 - 743