Kinetic analysis for the determination of cure-dependent mechanical properties of adhesives

被引：7

作者：

Schiel, M. ^{[1
]}

Dilger, K. ^{[1
]}

机构：

[1] Tech Univ Carolo Wilhelmina Braunschweig, Inst Joining & Welding, Braunschweig, Germany

来源：

PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART L-JOURNAL OF MATERIALS-DESIGN AND APPLICATIONS | 2014年 / 228卷 / 02期

关键词：

differential scanning calorimetry; Curing; adhesive; rheology; ACTIVATION-ENERGY; THERMAL-ANALYSIS; THERMOGRAVIMETRY; COMPUTATIONS;

D O I：

10.1177/1464420713520144

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This work presents a methodology for correlating the mechanical properties determined by rheological measurements with the degree of cure that has been measured in differential scanning calorimetry. Therefore, a model-based as well as a model-free kinetic approach is used to calculate the degree of cure depending on the temperature profile the sample is submitted to during the rheological measurements. Afterwards the rheological data is related to this degree of cure. The combination of these different techniques of thermal analysis show good correlation and offer a deeper understanding of the development of the mechanical properties during cure.

引用

页码：92 / 99

页数：8

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