Coupled electromagnetic thermal and kinetic modeling for microwave processing of polymers with temperature- and cure-dependent permittivity using 3D FEM

被引:3
|
作者
Sun, Rensheng [1 ,2 ]
Kempel, Leo C. [2 ]
Zong, Liming [3 ]
Hawley, Martin C. [3 ]
Benard, Andre [4 ]
机构
[1] EM Software & Syst USA Inc, Hampton, VA 23666 USA
[2] Michigan State Univ, Dept Elect & Comp Engn, E Lansing, MI 48824 USA
[3] Michigan State Univ, Dept Chem Engn & Mat Sci, E Lansing, MI 48824 USA
[4] Michigan State Univ, Dept Mech Engn, E Lansing, MI 48824 USA
基金
美国国家科学基金会;
关键词
Multiphysics modeling; finite element method (FEM); temperature- and cure-dependent permittivity; microwave thermoset curing;
D O I
10.3233/JAE-2009-1033
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents a self-consistent 3D marching-in-time multiphysics model, which includes electromagnetic field distribution, microwave power absorption, heat transfer, and polymer curing kinetics. Temperature-and cure-dependent permittivity and curing kinetics for DGEBA/DDS based on experimental data are explicitly included in the model. An edge-based finite element method (FEM) is implemented for the electromagnetic model, whereas node-based FEM is used in the heat transfer model. The numerical results can be used to determine the time-dependent temperature distribution and curing profile across the polymer sample, as well as the electromagnetic field distribution within the cavity applicator. The numerical results are compared with the measured data and a good agreement is achieved.
引用
收藏
页码:9 / 28
页数:20
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