Atomic layer deposition of copper metal for advanced interconnect materials.

被引：0
|
作者：
Bradley, AZ [1 ]
机构：
[1] DuPont Co Inc, Expt Stn, Cent Res & Dev, Wilmington, DE 19880 USA
来源：
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY | 2004年 / 228卷
关键词：
D O I：
暂无
中图分类号：
O6 [化学];
学科分类号：
0703 ;
摘要：
343-INOR
引用
收藏
页码：U830 / U830
页数：1
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