Atomic layer deposition of copper metal for advanced interconnect materials.

被引：0
|
作者：
Bradley, AZ [1 ]
机构：
[1] DuPont Co Inc, Expt Stn, Cent Res & Dev, Wilmington, DE 19880 USA
来源：
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY | 2004年 / 228卷
关键词：
D O I：
暂无
中图分类号：
O6 [化学];
学科分类号：
0703 ;
摘要：
343-INOR
引用
收藏
页码：U830 / U830
页数：1
相关论文
共 50 条
  • [21] ADVANCED CERAMICS AS METAL CUTTING TOOL MATERIALS.
    Jack, David
    Chemistry and Industry (London), 1986, (19): : 646 - 650
  • [22] Atomic Layer Deposition of Gold Metal
    Griffiths, Matthew B. E.
    Pallister, Peter J.
    Mandia, David J.
    Barry, Sean T.
    CHEMISTRY OF MATERIALS, 2016, 28 (01) : 44 - 46
  • [23] Atomic layer deposition of metal phosphates
    Henderick, Lowie
    Dhara, Arpan
    Werbrouck, Andreas
    Dendooven, Jolien
    Detavernier, Christophe
    APPLIED PHYSICS REVIEWS, 2022, 9 (01)
  • [24] Copper oxide atomic layer deposition on thermally pretreated multi-walled carbon nanotubes for interconnect applications
    Melzer, Marcel
    Waechtler, Thomas
    Muller, Steve
    Fiedler, Holger
    Hermann, Sascha
    Rodriguez, Raul D.
    Villabona, Alexander
    Sendzik, Andrea
    Mothes, Robert
    Schulz, Stefan E.
    Zahn, Dietrich R. T.
    Hietschold, Michael
    Lang, Heinrich
    Gessner, Thomas
    MICROELECTRONIC ENGINEERING, 2013, 107 : 223 - 228
  • [25] Atomic layer chemical vapour deposition of copper
    Mane, AU
    Shivashankar, SA
    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2004, 7 (4-6) : 343 - 347
  • [26] Atomic layer deposition of copper seed layers
    Solanki, R
    Pathangey, B
    ELECTROCHEMICAL AND SOLID STATE LETTERS, 2000, 3 (10) : 479 - 480
  • [27] Atomic layer deposition enabled interconnect technology for vertical nanowire arrays
    Cheng, Jen-Hau
    Seghete, Dragos
    Lee, Myongjai
    Schlager, John B.
    Bertness, Kris A.
    Sanford, Norman A.
    Yang, Ronggui
    George, Steven M.
    Lee, Y. C.
    SENSORS AND ACTUATORS A-PHYSICAL, 2011, 165 (01) : 107 - 114
  • [28] Advanced membranes enabled by atomic layer deposition
    Wang, Yong
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2017, 253
  • [29] Copper metal deposition for advanced interconnects
    Bradley, AZ
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2005, 230 : U2000 - U2001
  • [30] The use of atomic layer deposition in advanced nanopatterning
    Mackus, A. J. M.
    Bol, A. A.
    Kessels, W. M. M.
    NANOSCALE, 2014, 6 (19) : 10941 - 10960
12345